Method and device using a ceramic bond material for bonding metallic interconnect to ceramic electrode
View Patent ↗An electrochemical device includes a ceramic electrode, a metallic interconnect, and a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together. The ceramic material includes manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect.
1. An electrochemical device comprising:
a ceramic electrode;
a metallic interconnect; and
a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together, the ceramic bond material comprising manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect, wherein the ceramic electrode comprises strontium-doped lanthanum manganite and the metallic interconnect comprises nickel-based alloy coated with manganese cobalt ferrite with or without dopants.
2. The electrochemical device as recited in claim 1 , wherein the manganese-cobalt-oxide comprises Mn 1.5 Co 1.5 O 4 .
3. The electrochemical device as recited in claim 1 , wherein the manganese-cobalt-oxide comprises Mn 2 CoO 4 .
4. The electrochemical device as recited in claim 1 , wherein the manganese-cobalt-oxide comprises MnCo 2 O 4 .
5. The electrochemical device as recited in claim 1 , wherein the manganese-cobalt-oxide comprises Mn 2 CoO 4 and MnCo 2 O 4 .
6. The electrochemical device as recited in claim 1 , wherein the ceramic bond material includes a dopant selected from a group consisting of rare earth elements and mixtures thereof.
7. The electrochemical device as recited in claim 1 , wherein the ceramic bond material includes a ceria dopant.
8. The electrochemical device as recited in claim 1 , wherein the ceramic bond material includes a dopant selected from a group consisting of rare earth oxides and mixtures thereof.
9. The electrochemical device as recited in claim 1 , wherein the ceramic bond material includes a dopant selected from a group consisting of iron, chromium, nickel, copper, zinc, zinc oxide, and mixtures thereof.
10. The electrochemical device as recited in claim 1 , wherein the ceramic bond material is in direct contact with the ceramic electrode and the metallic interconnect.
11. An electrochemical device comprising:
a ceramic electrode;
a metallic interconnect; and
a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together, the ceramic bond material comprising manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect, wherein the ceramic electrode comprises strontium-doped lanthanum cobalt-doped ferrite and the metallic interconnect comprises nickel-based alloy coated with manganese cobalt ferrite with or without dopants.
12. The electrochemical device as recited in claim 11 , wherein the manganese-cobalt-oxide comprises Mn 1 . 5 Co 1.5 O 4 .
13. The electrochemical device as recited in claim 11 , wherein the manganese-cobalt-oxide comprises Mn 2 CoO 4 .
14. The electrochemical device as recited in claim 11 , wherein the manganese-cobalt-oxide comprises Mn 2 CoO 4 .
15. The electrochemical device as recited in claim 11 , wherein the manganese-cobalt-oxide comprises Mn 2 CoO 4 and MnCo 2 O 4 .
16. The electrochemical device as recited in claim 11 , wherein the ceramic bond material includes a dopant selected from a group consisting of rare earth elements and mixtures thereof.
17. The electrochemical device as recited in claim 11 , wherein the ceramic bond material includes a ceria dopant.
18. The electrochemical device as recited in claim 11 , wherein the ceramic bond material includes a dopant selected from a group consisting of rare earth oxides and mixtures thereof.
19. The electrochemical device as recited in claim 11 , wherein the ceramic bond material includes a dopant selected from a group consisting of iron, chromium, nickel, copper, zinc, zinc oxide, and mixtures thereof.
20. The electrochemical device as recited in claim 11 , wherein the ceramic bond material is in direct contact with the ceramic electrode and the metallic interconnect.