Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same
View Patent ↗A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 μm in a surface layer up to a depth of 50 μm from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.
1. A soft dilute copper alloy material, consisting of:
not lower than 5 mass ppm and not higher than 12 mass ppm of sulfur;
not lower than 7 mass ppm and not more than 30 mass ppm of oxygen;
not lower than 10 mass ppm and not higher than 37 mass ppm of titanium; and
a balance consisting of copper and unavoidable impurities,
wherein a softening temperature is 130° C. to 148° C.,
wherein an average crystal grain size is at least 5 μm and not more than 20 μm in a surface layer up to a depth of 50 μm from a surface,
wherein the average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer,
wherein a size of particles precipitated from the titanium, as distributed in the crystal grains, is not more than 1000 nm and a percentage of particles which are not more than 500 nm is not less than 90%, and
wherein a wire rod comprising the soft dilute copper alloy material is drawn into a wire so as to have a conductivity of not less than 102% IACS (International Annealed Copper Standard).
2. The soft dilute copper alloy material according to claim 1 , wherein a crystalline structure of the soft dilute copper alloy material comprises a recrystallized structure.
3. The soft dilute copper alloy material according to claim 1 , wherein the titanium is present precipitated in a crystal grain or at a crystal grain boundary of copper in a form of one or more of TiO, TiO 2 , TiS, and Ti—O—S.
4. The soft dilute copper alloy material according to claim 1 , wherein a portion of the sulfur and the titanium includes a compound or an aggregate in a form of one or more of TiO, TiO 2 , TiS, and Ti—O—S, and a remaining of the sulfur and the titanium is present in a form of a solid solution.
5. The soft dilute copper alloy material according to claim 3 , the TiO with a size of not more than 200 nm, the TiO 2 with a size of not more than 1000 nm, the TiS with a size of not more than 200 nm, and the Ti—O—S with a size of not more than 300 nm, as distributed in the crystal grains.
6. A soft dilute copper alloy wire, comprising:
the soft dilute copper alloy material according to claim 1 .
7. The soft dilute copper alloy wire according to claim 6 , wherein a softening temperature thereof is 130° C. to 148° C. when having a diameter of 2.6 mm.
8. The soft dilute copper alloy wire according claim 6 , wherein a plated layer is formed on the surface.
9. A soft dilute copper alloy stranded wire, comprising:
a plurality of ones of the soft dilute copper alloy wire according to claim 6 being stranded.
10. A cable, comprising:
the soft dilute copper alloy wire according to claim 6 ; and
an insulation layer around the soft dilute copper alloy wire.
11. A cable, comprising:
the soft dilute copper alloy stranded wire according to claim 9 ; and
an insulation layer around the stranded wire.
12. A coaxial cable, comprising:
a central conductor formed with a plurality of ones of the soft dilute copper alloy wire according to claim 6 being stranded;
an insulation covering formed on an outer periphery of the central conductor;
an outer conductor comprising copper or a copper alloy arranged on an outer periphery of the insulation covering; and
a jacket layer located on an outer periphery of the outer conductor.
13. A composite cable, comprising:
a plurality of ones of the cable according to claim 10 arranged in a shield layer; and
a sheath on an outer periphery of the shield layer.
14. A composite cable, comprising:
a plurality of ones of the coaxial cable according to claim 12 arranged in a shield layer; and
a sheath on an outer periphery of the shield layer.
15. A soft dilute copper alloy sheet, comprising:
the soft dilute copper alloy material according to claim 1 .
16. A soft dilute copper alloy sheet, comprising:
the soft dilute copper alloy material according to claim 1 being shaped and annealed.
17. The soft dilute copper alloy sheet according to claim 16 , wherein a crystalline structure of the soft dilute copper alloy material comprises a recrystallized structure.
18. The soft dilute copper alloy sheet according to claim 17 , wherein a portion of the sulfur and the titanium includes a compound or an aggregate in a form of one or more of TiO, TiO 2 , TiS, and Ti—O—S, and a remaining of the sulfur and the titanium is present in a form of a solid solution.
19. The soft dilute copper alloy sheet according to claim 18 , wherein the TiO with a size of not more than 200 nm, the TiO 2 with a size of not more than 1000 nm, the TiS with a size of not more than 200 nm or the Ti—O—S with a size of not more than 300 nm is distributed in a crystal grain.
20. The soft dilute copper alloy material according to claim 1 , wherein an edge of the inner portion is located at the depth of 50 μm from the surface.
21. The soft dilute copper alloy material according to claim 1 , wherein the titanium content is not lower than 10 mass ppm and not higher than 25 mass ppm.