Power semiconductor device
Provided is a power semiconductor device comprising a bonding joint that, even under a temperature environment of 150° C. or greater enabling operation of a wide bandgap semiconductor, reduces cracking-destruction occurring owing to thermal cycle while conductively connecting an electrode, connection terminal, and semiconductor device substrate. It is a power semiconductor device capable of operating under a temperature of 150° C. or greater having an electrode laminated on a wide bandgap semiconductor substrate and a connection terminal joined to the electrode for connection to external wiring, which power semiconductor device is characterized in that difference among the three coefficients of linear expansion of the electrode, a core of the connection terminal, and the semiconductor device substrate is 5.2×10 −6 /K at maximum, and that it comprises a joint that directly joins the connection terminal and the electrode.
1. A power semiconductor device operable under a temperature environment of 150° C. or greater, the power semiconductor device comprising:
a wide bandgap semiconductor device substrate;
an electrode laminated on the wide bandgap semiconductor device substrate; and
a connection terminal for connection to external wiring to be connected to the electrode;
wherein a difference among the three coefficients of linear expansion of the electrode, a core of the connection terminal, and the semiconductor device substrate is 5.2×10 −6 /K at a maximum, and
a joint joining the connection terminal and the electrode directly joins the connection terminal and the electrode.
2. The power semiconductor device as set out in claim 1 , wherein the core of the connection terminal is composed of molybdenum, tungsten, or an alloy thereof.
3. The power semiconductor device as set out in claim 2 , wherein the connection terminal is formed by coating the surface of the core with a metal whose electrical resistivity is 4×10 −8 Ω·m or less.
4. The power semiconductor device as set out in claim 3 , wherein the area of the metal coating in a cross-section of the connection terminal is 70% or less with respect to said cross-section.
5. The power semiconductor device as set out in any one of claims 1 to 4 , wherein the semiconductor device substrate is composed of silicon carbide, gallium nitride or diamond.
6. The power semiconductor device as set out in any one of claims 1 to 4 , wherein the joint joining the electrode and the connection terminal is a joint joined by ultrasonic vibration.
7. The power semiconductor device as set out in any one of claims 1 to 4 , wherein the electrode is composed of molybdenum, tungsten, or an alloy thereof.