IP Library Granted Patent US 8,749,120
Granted Patent B2
US 8,749,120 · App. 13/580,945 · Granted Jun 10, 2014

Flexible micro bumps operably coupled to an array of nano-piezoelectric sensors

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Quick Facts
Patent No.
US 8,749,120
App. No.
13/580,945
Granted
Jun 10, 2014
Kind
B2
Abstract

Implementations and techniques for manufacturing flexible micro bumps operably coupled to an array of nano-piezoelectric sensors are generally disclosed. The micro bumps and coupled nano-piezoelectric device have use at least as tactile sensors. A wide variety of configurations of the micro bumps and the nano-piezoelectric device are anticipated.

Claims (52)

1. An apparatus comprising:

a flexible substrate;

an array of nano-piezoelectric sensors operably coupled to the flexible substrate, wherein the array of nano-piezoelectric sensors comprises a layer of nano-piezoelectric wires; and

a plurality of flexible micro bumps operably coupled to the array of nano-piezoelectric sensors.

2. The apparatus of claim 1 , wherein the apparatus is configured to sense a pressure distribution and surface morphology through a static-type contact and/or sense a surface texture through a dynamic-type contact, wherein the pressure distribution and surface morphology and/or surface texture is based at least in part on frequency, amplitude, and polarity data from the array of nano-piezoelectric sensors.

3. The apparatus of claim 1 , further comprising:

a layer of flexible insulation material located between the nano-piezoelectric wires;

a top layer of flexible insulation material; and

a static-charge screen material, wherein the top layer of flexible insulation material and the static-charge screen material are located between the plurality of flexible micro bumps and the array of nano-piezoelectric sensors.

4. The apparatus of claim 1 , wherein the nano-piezoelectric wires comprise one or more of the following materials: zinc oxide-type nano-wire, gallium nitride-type nano-wire, and/or lead zirconatetitanate-type nano-wire.

5. An article comprising:

a signal bearing medium comprising machine-readable instructions stored thereon, which, if executed by one or more processors, operatively enable a computing device to:

deposit a plurality of bottom electrodes on a flexible substrate, wherein the deposited plurality of bottom electrodes have a substantially parallel pattern;

deposit a plurality of nano-piezoelectric wires on the flexible substrate, wherein the deposited plurality of nano-piezoelectric wires have a substantially checkerboard pattern;

deposit a plurality of top electrodes such that the plurality of top electrodes are electrically coupled to the plurality of nano-piezoelectric wires to form an array of nano-piezoelectric sensors, wherein the deposited plurality of top electrodes have a substantially parallel pattern; and

deposit a plurality of flexible micro bumps on the array of nano-piezoelectric sensors, wherein the plurality of flexible micro bumps are operably coupled to the array of nano-piezoelectric sensors.

6. The article of claim 5 , wherein the plurality of nano-piezoelectric wires comprise one or more of the following materials: zinc oxide-type nano-wire, gallium nitride-type nano-wire, and/or lead zirconatetitanate-type nano-wire.

7. A method, comprising:

depositing a plurality of nano-piezoelectric wires on a flexible substrate, wherein the deposited plurality of nano-piezoelectric wires have a substantially parallel pattern;

removing portions of the deposited plurality of nano-piezoelectric wires to form substantially checkerboard pattern;

depositing a plurality of bottom electrodes on the flexible substrate in electrical contact with the nano-piezoelectric wires, wherein the deposited plurality of bottom electrodes have a substantially parallel pattern;

depositing a plurality of top electrodes such that the plurality of top electrodes are electrically coupled to the plurality of nano-piezoelectric wires to form an array of nano-piezoelectric sensors, wherein the deposited plurality of top electrodes have a substantially parallel pattern; and

depositing a plurality of flexible micro bumps on the array of nano-piezoelectric sensors, wherein the plurality of flexible micro bumps are operably coupled to the array of nano-piezoelectric sensors.

8. A method, comprising:

depositing a plurality of bottom electrodes on a flexible substrate, wherein the deposited plurality of bottom electrodes have a substantially parallel pattern;

depositing a plurality of nano-piezoelectric wires on the flexible substrate, wherein the deposited plurality of nano-piezoelectric wires have a substantially checkerboard pattern;

depositing a plurality of top electrodes such that the plurality of top electrodes are electrically coupled to the plurality of nano-piezoelectric wires to form an array of nano-piezoelectric sensors, wherein the deposited plurality of top electrodes have a substantially parallel pattern; and

depositing a plurality of flexible micro bumps on the array of nano-piezoelectric sensors, wherein the plurality of flexible micro bumps are operably coupled to the array of nano-piezoelectric sensors.

9. The method of claim 8 , further comprising:

depositing a layer of catalyst on the substrate prior to depositing the nano-piezoelectric wires, wherein the deposited layer of catalyst has a substantially checkerboard pattern; and

wherein depositing the plurality of nano-piezoelectric wires on the substrate comprises depositing the plurality of nano-piezoelectric wires on the layer of catalyst, wherein the plurality of nano-piezoelectric wires have a perpendicular orientation with respect to the substrate.

10. The method of claim 8 , further comprising depositing a layer of flexible insulation material between the plurality of nano-piezoelectric wires prior to depositing the plurality of top electrodes.

11. The method of claim 8 , further comprising:

depositing a top layer of flexible insulation material on the plurality of top electrodes prior to depositing the plurality of flexible micro bumps; and

depositing a static-charge screen material on the top layer of flexible insulation material, wherein the top layer of flexible insulation material and the static-charge screen material are located between the plurality of flexible micro bumps and the array of nano-piezoelectric sensors.

12. The method of claim 8 , further comprising:

depositing a layer of catalyst on the substrate prior to depositing the nano-piezoelectric wires, wherein the deposited layer of catalyst has a substantially checkerboard pattern;

wherein depositing the plurality of nano-piezoelectric wires on the substrate comprises depositing the plurality of nano-piezoelectric wires on the layer of catalyst, wherein the plurality of nano-piezoelectric wires have a perpendicular orientation with respect to the substrate;

depositing a layer of flexible insulation material between the plurality of nano-piezoelectric wires prior to depositing the plurality of top electrodes;

depositing a top layer of flexible insulation material on the plurality of top electrodes prior to depositing the plurality of flexible micro bumps; and

depositing a static-charge screen material on the top layer of flexible insulation material, wherein the top layer of flexible insulation material and the static-charge screen material are located between the plurality of flexible micro bumps and the array of nano-piezoelectric sensors.

13. The method of claim 8 , wherein the flexible substrate comprises one or more of the following materials: polyimide, polyester, polyethylene terephthalate, polyethylene naphthalate, aramid, poly(dimethylsiloxane), epoxy, and/or liquid crystal polymer.

14. The method of claim 8 , wherein the plurality of nano-piezoelectric wires comprise one or more of the following materials: zinc oxide-type nano-wire, gallium nitride-type nano-wire, and/or lead zirconatetitanate-type nano-wire.

15. The method of claim 8 , wherein the plurality of flexible micro bumps form an uneven surface, and wherein individual micro bumps comprise a semi-circular-type shape and/or a semi elliptical-type shape.

16. The method of claim 8 , wherein the array of nano-piezoelectric sensors is configured to sense a pressure distribution and surface morphology through a static-type contact and/or sense a surface texture through a dynamic-type contact, wherein the pressure distribution and surface morphology and/or surface texture is based at least in part on frequency, amplitude, and polarity data from the array of nano-piezoelectric sensors.

17. The method of claim 7 , further comprising depositing a layer of insulation material on the plurality of bottom electrodes prior to depositing the plurality of top electrodes.

18. The method of claim 7 , further comprising:

depositing a top layer of flexible insulation material on the plurality of top electrodes prior to depositing the plurality of flexible micro bumps; and

depositing a static-charge screen material on the top layer of flexible insulation material, wherein the top layer of flexible insulation material and the static-charge screen material are located between the plurality of flexible micro bumps and the array of nano-piezoelectric sensors.

19. The method of claim 7 , wherein the plurality of nano-piezoelectric wires comprise one or more of the following materials: zinc oxide-type nano-wire, gallium nitride-type nano-wire, and/or lead zirconatetitanate-type nano-wire.

20. The method of claim 7 , wherein the plurality of flexible micro bumps form an uneven surface, and wherein individual micro bumps comprise a semi-circular type shape and/or a semi elliptical-type shape.

21. The method of claim 7 , wherein the array of nano-piezoelectric sensors is configured to sense a pressure distribution and surface morphology through a static-type contact and/or sense a surface texture through a dynamic-type contact, wherein the pressure distribution and surface morphology and/or surface texture is based at least in part on frequency, amplitude, and polarity data from the array of nano-piezoelectric sensors.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jul 31, 2019
From: CRESTLINE DIRECT FINANCE, L.P.
To: EMPIRE TECHNOLOGY DEVELOPMENT LLC
Reel/Frame 049924/0794 →
SECURITY INTEREST Recorded Jan 29, 2019
From: EMPIRE TECHNOLOGY DEVELOPMENT LLC
To: CRESTLINE DIRECT FINANCE, L.P.
Reel/Frame 048373/0217 →