IP Library Granted Patent US 8,769,803
Granted Patent B2
US 8,769,803 · App. 13/581,134 · Granted Jul 8, 2014

Speaker manufacturing method

Inventors: Toshiyuki Koike (Mie, JP); Shinsaku Sawa (Mie, JP); Tadashi Akiyama (Hokkaido, JP)
Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 8,769,803
App. No.
13/581,134
Granted
Jul 8, 2014
Kind
B2
Abstract

Provided is a method of manufacturing a loudspeaker including assembling a magnetic circuit and a frame. In the step of assembling the magnetic circuit and the frame, parallelism between a plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig. In addition, perpendicularity between a magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig. The magnetic circuit and the frame are assembled in such a state. With such a manufacturing method, it is possible to achieve a superior loudspeaker capable of reducing a gap defect while being downsized and having increased maximum input power.

Claims (19)

1. A method of manufacturing a loudspeaker, the method comprising the steps of:

assembling a magnetic circuit having a yoke, a magnet, and a plate;

assembling the magnetic circuit and a frame;

assembling a voice coil and a damper;

inserting the voice coil into a magnetic gap of the magnetic circuit, and coupling the frame with the damper; and

inserting and fixing the voice coil into and to a diaphragm, and assembling the frame and the diaphragm, wherein

in the step of assembling the magnetic circuit and the frame, the magnetic circuit and the frame are assembled, while parallelism between the plate and a damper attachment portion of the frame is ensured by bringing an upper portion of the plate and the damper attachment portion of the frame into contact with a jig, and while perpendicularity between the magnetic gap and the damper attachment portion of the frame is ensured by bringing an outer circumferential side portion of the plate of the magnetic gap and an inner circumferential side portion of the yoke into contact with the jig.

2. The method of manufacturing a loudspeaker according to claim 1 , wherein

the jig is configured by incorporating: a jig for ensuring parallelism between the plate and the damper attachment portion of the frame by being brought into contact with the upper portion of the plate and the damper attachment portion of the frame; and a jig for ensuring perpendicularity between the magnetic gap and the damper attachment portion of the frame by being brought into contact with the outer circumferential side portion of the plate of the magnetic gap and the inner circumferential side portion of the yoke.

3. The method of manufacturing a loudspeaker according to claim 1 , wherein

the jig is configured by a resin.

4. The method of manufacturing a loudspeaker according to claim 1 , wherein

the jig is configured by a metal.

5. The method of manufacturing a loudspeaker according to claim 1 , wherein

the jig includes a first plane and a second plane provided in parallel to each other,

the jig further includes a third plane and a fourth plane provided in parallel to each other and perpendicular to the first plane and the second plane, and

in the step of assembling the magnetic circuit and the frame,

parallelism between the damper attachment portion and a top surface of the plate is ensured by bringing the first plane of the jig into contact with the top surface of the damper attachment portion in parallel to each other, and by bringing the second plane into contact with the top surface of the plate in parallel to each other, and

perpendicularity between the damper attachment portion and the magnetic gap is ensured by bringing the third plane into contact with an inner circumferential side surface of the yoke in parallel to each other, and by bringing the fourth plane into contact with a circumferential side surface of the plate in parallel to each other.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2024
From: PANASONIC HOLDINGS CORPORATION
To: PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
Reel/Frame 066957/0984 →
CHANGE OF NAME Recorded Feb 21, 2024
From: PANASONIC CORPORATION
To: PANASONIC HOLDINGS CORPORATION
Reel/Frame 066644/0600 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2012
From: KOIKE, TOSHIYUKI; SAWA, SHINSAKU; AKIYAMA, TADASHI
To: PANASONIC CORPORATION
Reel/Frame 029243/0815 →
Priority Claims (1)
JP 2010-078345 · Mar 30, 2010 · national
Continuity (1)
Related Publication 20120317792A1 · Dec 20, 2012