Flip-chip photodiode
View Patent ↗A photodiode is provided according to various embodiments. In some embodiments, the photodiode includes a substrate and an active region. The active region is configured to receive light through the substrate. In such a configuration, the substrate not only participates in the photodiode operation acts as a light filter depending on the substrate material. In some embodiments, the active region may include solder balls that may be used to couple the photodiode to a printed circuit board. In some embodiments, the active region is coupled face-to-face with the printed circuit board.
1. A flip-chip photo diode, comprising: a substrate having a top and a bottom, wherein the substrate filters incident light; an active layer comprising a top and a bottom, wherein the top of the active layer is disposed below the bottom of the substrate; a plurality of interconnects coupled with the bottom of the active layer and configured to couple with a circuit board; and a plurality of wire bonds directly coupled with the top surface of the substrate and configured to couple with a circuit board.
2. The flip-chip photodiode according to claim 1 , wherein the plurality of interconnects comprise at least one solder ball or at least one epoxy bump.
3. The flip-chip photodiode according to claim 1 , wherein the substrate layer comprises indium phosphide.
4. The flip-chip photodiode according to claim 1 , wherein the active layer comprises a material selected from the group consisting of indium gallium arsenide, gallium arsenide, aluminum gallium arsenide, silicon, germanium, and lead sulfide.
5. The flip-chip photodiode according to claim 1 , wherein the substrate comprises silicon.
6. The flip-chip photodiode according to claim 1 , further comprising an antireflective coating on the top surface of the substrate.
7. The flip-chip photodiode according to claim 1 , wherein the substrate is used as a sunlight filter that eliminates the need for an added filter component.
8. The flip-chip photodiode according to claim 1 , wherein the substrate reduces photocurrent.
9. The flip-chip photodiode according to claim 1 , wherein the substrate reduces power consumption when reverse biased.