IP Library Granted Patent US 9,009,959
Granted Patent B2
US 9,009,959 · App. 13/586,979 · Granted Apr 21, 2015

Method of assembling mass storage device for a computer system

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Quick Facts
Patent No.
US 9,009,959
App. No.
13/586,979
Granted
Apr 21, 2015
Kind
B2
Abstract

A method and mass storage device that combine multiple solid state drives (SSDs) to a single volume. The device includes a carrier board and at least two solid state drives having power and data connections to the carrier board. The carrier board includes a circuit board functionally connected to a control logic and at least two secondary connectors that are disposed at different edges of the circuit board and functionally connected to the control logic. The solid state drives are connected to the carrier board through the secondary connectors, and each solid state drive has a power and data connector directly connected to one of the secondary connectors of the carrier board. The solid state drives are oriented substantially parallel to the carrier board and to each other.

Claims (9)

1. A method of assembling a mass storage device for a computer system, the method comprising:

providing a carrier board comprising a circuit board functionally connected to a control logic and secondary connectors disposed at different edges of the circuit board and functionally connected to the control logic through the circuit board; and

directly connecting at least two solid state drives to at least two of the secondary connectors of the carrier board to provide power and data connections therebetween, each of the solid state drives having a power and data connector that faces an interior surface region of the solid state drive and is directly connected to one of the secondary connectors of the carrier board, the solid state drives being mounted by the connectors so as to be oriented substantially parallel to the carrier board and to each other.

2. The method according to claim 1 , wherein the secondary connectors of the carrier board are male connectors that face outward from the carrier board, and the power and data connector of each of the solid state drives is a female connector.

3. The method according to claim 1 , wherein the edges at which the secondary connectors are disposed are opposite edges of the circuit board, the carrier board is positioned between the solid state drives, and the solid state drives overlap each other.

4. The method according to claim 1 , wherein the solid state drives are in the same plane on one side of the carrier board.

5. The method according to claim 1 , wherein the control logic is mounted on the circuit board of the carrier board and is connected to a primary connector means comprising an edge connector disposed on an edge of the circuit board.

6. The method according to claim 1 , wherein the control logic is mounted on an interface/control board and is connected to a primary connector means comprising an edge connector disposed on an edge of the interface/control board, the method further comprising connecting the interface/control board to the carrier board so as to functionally connect the circuit board of the carrier board to the control logic on the interface/control board.

7. The method according to claim 1 , further comprising the step of placing the carrier board and the solid state drives in an enclosure conforming to an industry standard hard disk drive form factor.

Assignments (13)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2017
From: TOSHIBA CORPORATION
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043620/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2016
From: OCZ STORAGE SOLUTIONS, INC.
To: TOSHIBA CORPORATION
Reel/Frame 038434/0371 →
RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 031611/0168) Recorded Apr 8, 2014
From: COLLATERAL AGENTS, LLC
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 032640/0455 →
RELEASE OF SECURITY INTEREST BY BANKRUPTCY COURT ORDER (RELEASES REEL/FRAME 030092/0739) Recorded Apr 8, 2014
From: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 032640/0284 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE AND ATTACH A CORRECTED ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 032365 FRAME 0920. ASSIGNOR(S) HEREBY CONFIRMS THE THE CORRECT EXECUTION DATE IS JANUARY 21, 2014. Recorded Mar 18, 2014
From: OCZ TECHNOLOGY GROUP, INC.
To: TAEC ACQUISITION CORP.
Reel/Frame 032461/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2014
From: OCZ TECHNOLOGY GROUP, INC.
To: TAEC ACQUISITION CORP.
Reel/Frame 032365/0920 →
CHANGE OF NAME Recorded Feb 27, 2014
From: TAEC ACQUISITION CORP.
To: OCZ STORAGE SOLUTIONS, INC.
Reel/Frame 032365/0945 →
SECURITY AGREEMENT Recorded Nov 11, 2013
From: OCZ TECHNOLOGY GROUP, INC.
To: COLLATERAL AGENTS, LLC
Reel/Frame 031611/0168 →
SECURITY AGREEMENT Recorded Mar 27, 2013
From: OCZ TECHNOLOGY GROUP, INC.
To: HERCULES TECHNOLOGY GROWTH CAPITAL, INC.
Reel/Frame 030092/0739 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2012
From: SCHUETTE, FRANZ MICHAEL
To: OCZ TECHNOLOGY GROUP, INC.
Reel/Frame 028804/0903 →