Method of manufacturing an input device
View Patent ↗Input device manufacture techniques are described. In one or more implementations, a plurality of layers of a key assembly is positioned in a fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers. The positioned plurality of layers is secured to each other.
1. A method comprising:
positioning a plurality of layers of a key assembly in a fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers, the key assembly includes a sensor substrate configured to be contacted by a flexible contact layer to initiate an input to be communicated to a computing device that is communicatively coupled to the key assembly; and
securing the positioned plurality of layers to each other.
2. A method as described in claim 1 , wherein the key assembly includes a plurality of pressure sensitive keys.
3. A method as described in claim 1 , wherein the positioning is performed such that the plurality of layers of the key assembly are positioned in an order such that a surface that is configured to receive pressure to initiate an input is positioned as facing a surface of the fixture.
4. A method as described in claim 1 , wherein the key assembly includes a force concentrator that is configured to channel pressure applied to the force concentrator to respective ones of a plurality of keys of the key assembly.
5. A method as described in claim 1 , wherein the key assembly includes a support board having one or more surface mount hardware elements.
6. A method as described in claim 1 , wherein the securing is performed using a heat-activated film.
7. A method as described in claim 1 , wherein the securing is performed using an adhesive layer that includes a matrix having a plurality of separated portions of adhesive.
8. A method comprising:
positioning a plurality of layers of a key assembly in a fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers, the key assembly includes a force concentrator that is configured to channel pressure applied to the force concentrator to respective ones of a plurality of keys of the key assembly; and
securing the positioned plurality of layers to each other.
9. A method as described in claim 8 , wherein the key assembly includes one or more layers of a pressure sensitive sensor stack.
10. A method as described in claim 9 , wherein the pressure sensitive key assembly includes a sensor substrate configured to be contacted by a flexible contact layer to initiate an input to be communicated to a computing device that is communicatively coupled to the key assembly.
11. A method as described in claim 8 , wherein the positioning is performed such that the plurality of layers of the key assembly are positioned in an order such that a surface that is configured to receive pressure to initiate an input is positioned as facing a surface of the fixture.
12. A method as described in claim 8 , wherein the key assembly includes a support board having one or more surface mount hardware elements.
13. A method as described in claim 8 , wherein the securing is performed using a heat-activated film.
14. A method as described in claim 8 , wherein the securing is performed using an adhesive layer that includes a matrix having a plurality of separated portions of adhesive.
15. A method comprising:
positioning a plurality of layers of a key assembly in a fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers, the key assembly including one or more layers of a pressure sensitive sensor stack; and
securing the positioned plurality of layers to each other using an adhesive layer that includes a matrix having a plurality of separated portions of adhesive.
16. A method as described in claim 15 , wherein the pressure sensitive sensor stack includes a sensor substrate configured to be contacted by a flexible contact layer to initiate an input to be communicated to a computing device that is communicatively coupled to the key assembly.
17. A method as described in claim 15 , wherein the pressure sensitive sensor stack includes a plurality of pressure sensitive keys.
18. A method as described in claim 15 , wherein the positioning is performed such that the plurality of layers of the key assembly are positioned in an order such that a surface that is configured to receive pressure to initiate an input is positioned as facing a surface of the fixture.
19. A method as described in claim 15 , wherein the key assembly includes a force concentrator that is configured to channel pressure applied to the force concentrator to respective ones of a plurality of keys of the key assembly.
20. A method as described in claim 15 , wherein the key assembly includes a support board having one or more surface mount hardware elements.
21. A method as described in claim 15 , wherein the securing is performed using a heat-activated film.
22. A system comprising:
a fixture configured to receive a plurality of layers of a key assembly positioned in the fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers, the key assembly including a sensor substrate configured to be contacted by a flexible contact layer to initiate an input to be communicated to a computing device that is communicatively coupled to the key assembly, the positioned plurality of layers being secured to each other.
23. A system as described in claim 22 , wherein the key assembly includes a plurality of pressure sensitive keys.
24. A system as described in claim 22 , wherein the plurality of layers of the key assembly are positioned in an order such that a surface that is configured to receive pressure to initiate an input is positioned as facing a surface of the fixture.
25. A system as described in claim 22 , wherein the key assembly includes a force concentrator that is configured to channel pressure applied to the force concentrator to respective ones of a plurality of keys of the key assembly.
26. A system as described in claim 22 , wherein the key assembly includes a support board having one or more surface mount hardware elements.
27. A system as described in claim 22 , wherein the positioned plurality of layers are secured to each other using a heat-activated film.
28. A system as described in claim 22 , wherein the positioned plurality of layers are secured to each other using an adhesive layer that includes a matrix having a plurality of separated portions of adhesive.
29. A system comprising:
a fixture configured to receive a plurality of layers of a key assembly positioned in the fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers, the key assembly includes a force concentrator that is configured to channel pressure applied to the force concentrator to respective ones of a plurality of keys of the key assembly, the positioned plurality of layers being secured to each other.
30. A system as described in claim 29 , wherein the key assembly includes one or more layers of a pressure sensitive sensor stack.
31. A system as described in claim 29 , wherein the pressure sensitive key assembly includes a sensor substrate configured to be contacted by a flexible contact layer to initiate an input to be communicated to a computing device that is communicatively coupled to the key assembly.
32. A system as described in claim 29 , wherein the plurality of layers of the key assembly are positioned in an order such that a surface that is configured to receive pressure to initiate an input is positioned as facing a surface of the fixture.
33. A system as described in claim 29 , wherein the key assembly includes a support board having one or more surface mount hardware elements.
34. A system as described in claim 29 , wherein the positioned plurality of layers are secured to each other using a heat-activated film.
35. A system as described in claim 29 , wherein the positioned plurality of layers are secured to each other using an adhesive layer that includes a matrix having a plurality of separated portions of adhesive.
36. A system comprising:
a fixture configured to receive a plurality of layers of a key assembly positioned in the fixture such that one or more projections of the fixture are disposed through one or more openings in each of the one or more layers, the key assembly including one or more layers of a pressure sensitive sensor stack, the positioned plurality of layers being secured to each other using an adhesive layer that includes a matrix having a plurality of separated portions of adhesive.
37. A system as described in claim 36 , wherein the pressure sensitive sensor stack includes a sensor substrate configured to be contacted by a flexible contact layer to initiate an input to be communicated to a computing device that is communicatively coupled to the key assembly.
38. A system as described in claim 36 , wherein the pressure sensitive sensor stack includes a plurality of pressure sensitive keys.
39. A system as described in claim 36 , wherein the plurality of layers of the key assembly are positioned in an order such that a surface that is configured to receive pressure to initiate an input is positioned as facing a surface of the fixture.
40. A system as described in claim 36 , wherein the key assembly includes a force concentrator that is configured to channel pressure applied to the force concentrator to respective ones of a plurality of keys of the key assembly.
41. A system as described in claim 36 , wherein the key assembly includes a support board having one or more surface mount hardware elements.
42. A system as described in claim 36 , wherein the positioned plurality of layers are secured to each other using a heat-activated film.