Composite upper for shoe with selectively disposed bonding agent
Footwear fabrication methods are disclosed, having reduced material consumption and/or waste requirements, compared to conventional methods, as well as the footwear articles made by such methods. The fabrication methods and articles are characterized by the selective use of a bonding agent, in the form of a powder or tackified (e.g., preheated) powder, to bond various material panels, such substrate, mesh, and/or skin panels in the formation of a composite panel (e.g., a bonded mesh composite panel), which may in turn be used to provide a footwear upper and ultimately an article of footwear. The bonding agent is particularly applicable to fabrication processes utilizing a combination of heat and pressure for bonding or fusing material panels, each having a suitable composition, size, shape, and thickness, into the particular configuration of the footwear upper.
1. An upper for an article of footwear, the upper having a bonded mesh composite panel comprising:
(a) a substrate layer;
(b) a mesh layer overlapping the substrate layer in a mesh/substrate overlap area that does not overlap the entire substrate layer; and
(c) a skin layer overlapping both the mesh and substrate layers in a skin/mesh/substrate overlap area, and
(d) a bonding agent that is selectively disposed (i) between the mesh and substrate layers, in the mesh/substrate overlap area, but disposed over only a subset of the mesh/substrate overlap area or (ii) between the mesh and skin layers, in the skin/mesh/substrate overlap area, but disposed over only a subset of the skin/mesh/substrate overlap area.
2. The upper of claim 1 , wherein the bonding agent is selectively disposed between the mesh and substrate layers, within at least one additional mesh/substrate overlap area.
3. The upper of claim 1 , wherein the bonding agent is disposed within the mesh/substrate overlap area at a first bonding layer thickness, that differs from a second bonding layer thickness at a second mesh/substrate overlap area, within which the bonding agent is also disposed.
4. The upper of claim 1 , wherein the bonding agent is pigmented with a first color and disposed in the mesh/substrate overlap area that differs from a second mesh/substrate area in which the bonding agent, having a second color that differs from the first color, is disposed.
5. The upper of claim 1 , wherein the bonding agent is thermoplastic polyurethane (TPU).
6. The upper of claim 1 , wherein the bonding agent has a melting temperature from about 80° C. to about 120° C.
7. An article of footwear comprising the upper of claim 1 , wherein
(i) the substrate layer has opposing inner and outer sides, the inner side facing an interior of the article and the outer side oriented away from the interior;
(ii) the mesh layer has opposing inner and outer sides, the inner side oriented toward the outer side of the substrate layer within the mesh/substrate bonding areas; and
(iii) the skin layer has opposing inner and outer sides, the inner side oriented toward the mesh and substrate layers within the skin/mesh/substrate overlap areas;
the article of footwear further comprising a foam midsole bonded to the composite panel, the composite panel including portions bonded to a bottom surface of the foam midsole.
8. The article of footwear of claim 7 , wherein at least a portion of the outer side of the skin layer faces the exterior of the article.
9. The upper of claim 1 , wherein the bonding agent is selectively disposed at a peripheral region within the mesh/substrate overlap area or the skin/mesh/substrate overlap area.
10. The upper of claim 9 , wherein the peripheral region surrounds a central region within the mesh/substrate overlap area or the skin/mesh/substrate overlap area, and wherein the bonding agent is absent from a central region.
11. The upper of claim 10 , wherein an additional material is encapsulated in the central region.
12. The upper of claim 1 , wherein the bonding agent is absent from an area in which the substrate layer overlaps the skin layer but not the mesh layer.
13. The upper of claim 1 , wherein the bonding agent is selectively disposed in the mesh/substrate overlap area, over only a subset of the mesh/substrate overlap area.
14. The upper of claim 13 , wherein the bonding agent is selectively disposed over from about 10% to about 90% of the mesh/substrate overlap area.
15. The upper of claim 14 , wherein the bonding agent is selectively disposed over from about 30% to about 80% of the mesh/substrate overlap area.
16. The upper of claim 13 , wherein the bonding agent is disposed over only a subset of at least one additional mesh/substrate overlap area.
17. The upper of claim 13 , wherein the bonding agent is selectively disposed at a plurality of discreet locations within the mesh/substrate overlap area.
18. The upper of claim 17 , wherein the plurality of discreet locations are in the form of a pattern, shape, image, or design.
19. The upper of claim 1 , wherein the bonding agent is selectively disposed in the skin/mesh/substrate overlap area, over only a subset of the skin/mesh/substrate overlap area.
20. The upper of claim 19 , wherein the bonding agent is disposed over only a subset of at least one additional skin/mesh/substrate overlap area.