High definition heater and method of operation
An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.
1. A heater comprising:
a base plate;
a base heater secured to the base plate, the base heater comprising at least one zone;
a substrate secured to the base heater;
a tuning heater secured to the substrate opposite the base heater, the tuning heater comprising a plurality of zones that is greater in number than the zones of the base heater, and the tuning heater providing lower power than the base heater; and
a chuck secured to the tuning heater opposite the substrate,
wherein the substrate defines a thermal conductivity to dissipate power from the base heater.
2. The heater according to claim 1 , wherein at least one of the base heater and the tuning heater comprise a resistive material with sufficient TCR characteristics such that the at least one base heater and the tuning heater function as both a heater and as a temperature sensor.
3. The heater according to claim 1 , wherein at least one of the base heater and the tuning heater define a layered construction.
4. The heater according to claim 1 , wherein at least one of the base heater and the tuning heater define a polyimide heater.
5. The heater according to claim 1 further comprising a plurality of tuning heaters defining resistive circuits that are offset from resistive circuits of adjacent tuning heaters.
6. The heater according to claim 1 further comprising a plurality of base heaters defining resistive circuits that are offset from resistive circuits of adjacent base heaters.
7. The heater according to claim 1 further comprising a secondary tuning layer secured to a top surface of the chuck.
8. The heater according to claim 1 further comprising a plurality of tuning layers.
9. The heater according to claim 1 , wherein the base heater comprises a plurality of support elements disposed between circuit traces of the base heater.
10. The heater according to claim 9 , wherein the support elements define a split configuration.
11. The heater according to claim 1 , wherein at least one of the base heater and the tuning heater are disposed around a periphery of the chuck.
12. The heater according to claim 1 further comprising a plurality of heat spreaders disposed proximate each of the zones of the tuning heater.
13. The heater according to claim 12 , wherein the heat spreaders are a material selected from the group consisting of Aluminum, Copper, Pyrolytic Graphite, and Aluminum Nitride.