Method of manufacturing a high definition heater system
Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.
1. A method of manufacturing a heater comprising:
forming a first laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer;
creating a circuit pattern into the conductive layer;
covering the circuit pattern with a second double-sided adhesive dielectric layer;
covering the second double-sided adhesive dielectric layer with a sacrificial layer to form a second laminate comprising the dielectric layer, the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive dielectric layer, and the sacrificial layer, wherein the circuit pattern and the sacrificial layer are disposed on opposing surfaces of the second double-sided adhesive dielectric layer, the sacrificial layer overlapping the circuit pattern;
pressing the second laminate that comprises the dielectric layer, the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive layer, and the sacrificial layer; and
subsequently removing the sacrificial layer after the pressing to form a heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the circuit pattern, and the second double-sided adhesive dielectric layer.
2. The method according to claim 1 , wherein the sacrificial layer is a copper material.
3. The method according to claim 1 , wherein the conductive layer is formed of a Nickel alloy material.
4. The method according to claim 1 , wherein the double-sided adhesive dielectric layers are formed of a polyimide material.
5. The method according to claim 1 , wherein each of the conductive layer and the dielectric layers each define a thickness between about 0.025 mm and about 0.050 mm.
6. The method according to claim 1 , wherein the circuit pattern is created by an etching process.
7. A method of manufacturing a heater, the method comprising:
forming a first laminate having a first double-sided adhesive dielectric layer, a first sacrificial layer on one side of the first double-sided adhesive dielectric layer, and a conductive layer on an opposite side of the first double-sided adhesive dielectric layer;
creating a circuit pattern into the conductive layer;
covering the circuit pattern with a second double-sided adhesive dielectric layer;
covering the second double-sided adhesive dielectric layer with a second sacrificial layer to form a second laminate comprising the first double-sided adhesive dielectric layer, the first sacrificial layer, the circuit pattern, the second double-sided adhesive dielectric layer, and the second sacrificial layer, wherein the circuit pattern and the second sacrificial layer are disposed on opposing surfaces of the second double-sided adhesive dielectric layer, the second sacrificial layer overlapping the circuit pattern;
pressing the second laminate that comprises the first double-sided adhesive dielectric layer, the first sacrificial layer, the circuit pattern, the second double-sided adhesive dielectric layer, and the second sacrificial layer; and
subsequently removing at least one of the first and second sacrificial layers after the pressing to form a heater comprising the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive dielectric layer, and at most one of the first and the second sacrificial layers.
8. The method according to claim 7 , wherein the sacrificial layers are a copper material.
9. The method according to claim 7 , wherein the double-sided adhesive dielectric layers are formed of a polyimide material.
10. The method according to claim 7 , wherein the conductive layer is formed of a Nickel alloy material.
11. The method according to claim 7 , wherein each of the conductive layer and the double-sided adhesive dielectric layers each define a thickness between about 0.025 mm and about 0.050 mm.
12. The method according to claim 7 , wherein the circuit pattern is created by an etching process.