Direct connection of lead bar to conductive ribbon in a thin film photovoltaic device
View Patent ↗Thin film photovoltaic devices that include at least one lead bar extending through a connection aperture defined in the encapsulation substrate are provided. The photovoltaic device can include: a transparent substrate; a plurality of photovoltaic cells on the transparent substrate; a first conductive ribbon electrically connected to a first photovoltaic cell; an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate; and, a first lead bar extending through a first connection aperture defined in the encapsulation substrate. The first lead bar is electrically connected to the first conductive ribbon. For example, a meltable conductive material can be connected to the first lead bar and to the first conductive ribbon to establish an electrical connection therebetween. Methods are also provided for electrically connecting a lead to a thin film photovoltaic device.
1. A thin film photovoltaic device, comprising:
a transparent substrate;
a plurality of photovoltaic cells on the transparent substrate;
a first conductive ribbon electrically connected to a first photovoltaic cell;
an encapsulation substrate laminated to the transparent substrate such that the plurality of photovoltaic cells and the conductive ribbon are positioned between the transparent substrate and the encapsulation substrate;
a first lead bar extending through a first connection aperture defined in the encapsulation substrate, wherein the first lead bar is electrically connected to the first conductive ribbon; and,
a meltable conductive material connected to the first lead bar and to the first conductive ribbon to establish an electrical connection therebetween; and
a back plate adhered to an exposed surface of the encapsulation substrate that is opposite of the transparent substrate, wherein the back plate defines a support aperture and is positioned such that the first lead bar extends through the support aperture.
2. The device as in claim 1 , wherein the meltable conductive material is a solder comprising tin, lead, antimony, bismuth, indium, silver, copper, cadmium, or alloys thereof.
3. The device as in claim 1 , further comprising:
a sealing material filling the first connection aperture with the first lead bar extending therethrough.
4. The device as in claim 1 , wherein the first connection aperture defines a first aperture diameter, and wherein the first conductive ribbon defines a first ribbon width, the first aperture diameter being less than the first ribbon width.
5. The device as in claim 1 , wherein the first lead bar has a first bar diameter, and wherein the first connection aperture defines a first aperture diameter, the first aperture diameter being about 100% to about 105% of the first bar diameter.
6. The device as in claim 3 , wherein the sealing material comprises synthetic polymeric material.
7. The device as claim 1 , further comprising:
a second conductive ribbon electrically attached to a second photovoltaic cell and positioned between the transparent substrate and the encapsulation substrate; and,
a second lead bar extending through a second connection aperture defined in the encapsulation substrate, wherein the second lead bar is electrically connected to the second conductive ribbon.
8. The device as claim 1 , further comprising:
a second conductive ribbon electrically attached to a second photovoltaic cell and positioned between the transparent substrate and the encapsulation substrate; and
a second lead bar extending through a second connection aperture defined in the encapsulation substrate, wherein the second lead bar is electrically connected to the second conductive ribbon; and,
wherein the back plate defines a second support aperture and the second lead bar extends through the second support aperture.
9. The device as in claim 1 , further comprising:
a junction box positioned on the exposed surface of the encapsulation substrate that is opposite of the transparent substrate, wherein the first lead bar extends out of the first connection aperture and is electrically connected to a first wire of the junction box.
10. The device as in claim 1 , wherein the first lead bar defines a first lead aperture therethrough.
11. The device as in claim 10 , wherein the first lead aperture is filled with the meltable conductive material.
12. The device as in claim 11 , wherein the first lead aperture is filled with a sealing material.
13. The device as in claim 1 , wherein the first lead bar defines a first lead tab configured to establish a mechanical connection having a biasing force between the first lead bar and the first conductive ribbon.