BACK JUNCTION SOLAR CELL WITH TUNNEL OXIDE
One embodiment of the present invention provides a back junction solar cell. The solar cell includes a base layer, a quantum-tunneling-barrier (QTB) layer situated below the base layer facing away from incident light, an emitter layer situated below the QTB layer, a front surface field (FSF) layer situated above the base layer, a front-side electrode situated above the FSF layer, and a back-side electrode situated below the emitter layer.
1 . A method for fabricating a back junction solar cell, comprising:
obtaining a base layer for the solar cell;
forming a quantum-tunneling-barrier (QTB) layer at a backside of the base layer facing away from incident light;
forming an emitter layer underneath the QTB layer, wherein a doping type of the emitter layer is opposite to a doping type of the base layer;
forming a front surface field (FSF) layer above the base layer;
forming a front-side electrode above the FSF layer; and
forming a back-side electrode underneath the emitter layer.
2 . The method of claim 1 , wherein the base layer comprises at least one of:
a mono-crystalline silicon wafer; and
an epitaxially grown crystalline-Si (c-Si) thin film.
3 . The method of claim 2 , wherein the epitaxially grown c-Si thin film's doping profile is modulated.
4 . The method of claim 1 , wherein the QTB layer comprises at least one of:
silicon oxide (SiO x );
hydrogenerated SiO x ;
silicon nitride (SiN x );
hydrogenerated SiN x ;
aluminum oxide (AlO x );
silicon oxynitride (SiON); and
hydrogenerated SiON.
5 . The method of claim 1 , wherein the QTB layer has a thickness between 1 and 50 angstroms.
6 . The method of claim 1 , wherein the QTB layer is formed using at least one of the following techniques:
thermal oxidation;
atomic layer deposition;
wet or steam oxidation;
low-pressure radical oxidation; and
plasma-enhanced chemical-vapor deposition (PECVD).
7 . The method of claim 1 , further comprising forming a transparent conductive oxide (TCO) layer on surface of the emitter layer, the FSF layer, or both.
8 . The method of claim 7 , wherein the TCO layer comprises at least one of:
indium-tin-oxide (ITO);
indium oxide (InO);
indium-zinc-oxide (IZO);
tungsten-doped indium-oxide (IWO);
tin-oxide (SnO x );
aluminum doped zinc-oxide (ZnO:Al or AZO); and
gallium doped zinc-oxide (ZnO:Ga).
9 . The method of claim 1 , wherein the emitter layer and/or the FSF layer comprise at least one of:
amorphous-Si (a-Si);
polycrystalline Si; and
one or more wide bandgap semiconductor materials.
10 . The method of claim 9 , wherein the emitter layer and/or the FSF layer comprise a graded-doped amorphous-Si (a-Si) layer with a doping concentration ranging between 1×10 15 /cm 3 and 5×10 20 /cm 3 .
11 . The method of claim 1 , further comprising forming a front QTB layer at a frontside of the base layer facing the incident sunlight.
12 . A back junction solar cell, comprising:
a base layer;
a quantum-tunneling-barrier (QTB) layer situated below the base layer facing away from incident light;
an emitter layer situated below the QTB layer;
a front surface field (FSF) layer situated above the base layer;
a front-side electrode situated above the FSF layer; and
a back-side electrode situated below the emitter layer.
13 . The solar cell of claim 12 , wherein the base layer comprises at least one of:
a mono-crystalline silicon wafer; and
an epitaxially grown crystalline-Si (c-Si) thin film.
14 . The solar cell of claim 13 , wherein the epitaxially grown c-Si thin film's doping profile is modulated.
15 . The solar cell of claim 12 , wherein the QTB layer comprises at least one of:
silicon oxide (SiO x );
hydrogenerated SiO x ;
silicon nitride (SiNO x );
hydrogenerated SiN x ;
aluminum oxide (AlO x );
silicon oxynitride (SiON); and
hydrogenerated SiON.
16 . The solar cell of claim 12 , wherein the QTB layer has a thickness between 1 and 50 angstroms.
17 . The solar cell of claim 12 , wherein the QTB layer is formed using at least one of the following techniques:
thermal oxidation;
atomic layer deposition;
wet or steam oxidation;
low-pressure radical oxidation; and
plasma-enhanced chemical-vapor deposition (PECVD).
18 . The solar cell of claim 12 , further comprising at least one of:
a first transparent conductive oxide (TCO) layer situated below the emitter layer; and
a second TCO layer situated above the FSF layer.
19 . The solar cell of claim 18 , wherein the first and second TCO layers comprises at least one of:
indium-tin-oxide (ITO);
indium oxide (InO);
indium-zinc-oxide (IZO);
tungsten-doped indium-oxide (IWO);
tin-oxide (SnOx);
aluminum doped zinc-oxide (ZnO:Al or AZO); and
gallium doped zinc-oxide (ZnO:Ga).
20 . The solar cell of claim 12 , wherein the emitter layer and/or the FSF layer comprise at least one of:
amorphous-Si (a-Si);
polycrystalline Si; and
one or more wide bandgap semiconductor materials.
21 . The solar cell of claim 20 , wherein the emitter and/or the surface field layer comprise a graded-doped amorphous-Si (a-Si) layer with a doping concentration ranging between 1×10 15 /cm 3 and 5×10 20 /cm 3 .
22 . The solar cell of claim 12 , further comprising a front QTB layer situated between the FSF layer and the base layer.