Microstructure film
View Patent ↗The present invention is directed to a microstructure film comprising an area of microstructures and two edge areas, wherein the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures, preferably by about 1 μm to about 1 mm. The application also describes how such a film may be manufactured.
1. An embossing assembly for manufacturing a microstructure film, comprising:
a) a drum;
b) an embossing shim tightly wrapped around the drum wherein the embossing shim has a three-dimensional pattern for forming microstructures;
c) a tape laminated around each end of the embossing shim; and
d) a deformable nip roller capable of pressing against the tape and the embossing shim to create spaces for an embossing composition to enter to form edge areas.
2. The assembly of claim 1 , wherein the microstructure film comprises an area of microstructures and two edge areas, the height of the highest part in each of the edge areas exceeds the height of the highest point in the microstructures, the two edge areas and the microstructures are on opposite sides of the film, and all the heights are measured from the same base line.
3. The assembly of claim 2 , wherein, in the microstructure film, the highest part in the edge areas is a spacer line.
4. The assembly of claim 3 , wherein the spacer line has a width which is in the range of about 3 μm to about 30 mm.
5. The assembly of claim 2 , wherein, in the microstructure film, the height of the highest part in the edge areas exceeds the height of the highest point in the microstructures by about 1μ to about 1 mm.
6. The assembly of claim 5 , wherein, in the microstructure film, the height of the highest part in the edge areas is the thickness of the thickest part in the edge areas.