Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design
View Patent ↗Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.
1. A printed circuit board (PCB) configured for impedance discontinuity remediation for transmission line via stubs, the PCB comprising:
a plurality of PCB components interconnected across different trace layers in the PCB;
a transmission driver communicatively coupled to a receiver over a transmission line comprising a via connecting two of the trace layers of the PCB and terminating in a via stub; and,
a pre-distortion finite input response (FIR) filter coupled to the transmission driver, the filter comprising a transfer function inverting an error response for the transmission line.
2. The PCB of claim 1 , wherein the FIR filter comprises coefficients selected for peaking maximum energy in a produced pulse shape.
3. The PCB of claim 1 , wherein the error response comprises a difference between a desired frequency response for the transmission line and a frequency response for the transmission line.
4. The PCB of claim 1 , further comprising a backplane connector for connecting to a backplane in a computing system.