Semiconductor device and method of manufacturing semiconductor device
View Patent ↗A semiconductor device includes a first insulating film formed above a semiconductor substrate, a fuse formed above the first insulating film, a second insulating film formed above the first insulating film and the fuse and including an opening reaching the fuse, and a third insulating film formed above the second insulating film and in the opening.
1. A semiconductor device comprising:
a semiconductor substrate;
a first insulating film formed above the semiconductor substrate;
a fuse formed above the first insulating film, the fuse including a first region and a second region;
a fourth insulating film formed on the first insulating film and the fuse, whole of the side surface of the fuse of the first region being covered by a part of the fourth insulating film;
a second insulating film formed above the first insulating film and formed on the fuse, the second insulating film including an opening formed therethrough, the opening exposing the part of the fourth insulating film; and
a third insulating film formed above the second insulating film and in the opening, whole of the part of the fourth insulating film being covered by the third insulating film.
2. The semiconductor device according to claim 1 , wherein
a melting point of the third insulating film is lower than a melting point of the second insulating film.
3. A semiconductor device comprising:
a semiconductor substrate;
a first insulating film formed above the semiconductor substrate;
a fuse formed above the first insulating film, the fuse including a first region and a second region;
a fourth insulating film formed on the first insulating film and the fuse, whole of the side surface of the fuse of the first region being covered by a part of the fourth insulating film;
a second insulating film formed above the first insulating film and formed on the fuse, the second insulating film including an opening formed therethrough, the opening exposing the part of the fourth insulating film;
a third insulating film, which covers whole of the part of the fourth insulating film, formed in the opening;
a fifth insulating film, which has a melting point higher than a melting point of the third insulating film, formed on the second insulating film.
4. The semiconductor device according to claim 3 , wherein
the third insulation film includes an insulating material which is formed of silicon oxide containing impurity, or SOG.
5. A semiconductor device comprising:
a semiconductor substrate;
a first insulating film formed above the semiconductor substrate;
a second insulating film, which includes an opening, formed on the first insulating film;
a fuse formed on the first insulating film and located in the opening, the fuse including a first region and a second region;
a third insulating film formed on the fuse and on the first insulating film;
a gap formed between the first insulating film and the third insulation film, and located below the first region of the fuse.
6. The semiconductor device according to claim 1 , wherein
a stress the second insulating film applies to the semiconductor substrate is large than a stress the first insulating film and the third insulating film apply to the semiconductor substrate.
7. The semiconductor device according to claim 1 , wherein
the second insulating film is an etching stopper film, and
the third insulating film is an inter-layer insulating film.
8. The semiconductor device according to claim 1 , wherein
the second insulating film is formed of an insulating material mainly formed of silicon nitride, and
the third insulating film is formed of an insulation material mainly formed of silicon oxide.
9. The semiconductor device according to claim 1 , wherein
the fuse has a first width in the first region and a second width larger than the first width in the second region.
10. The semiconductor device according to claim 9 , wherein
the fuse further includes a third region having a third width larger than the first width,
the first region is located between the second region and the third region.
11. The semiconductor device according to claim 1 , further comprising
a fourth insulating film formed between the fuse and the second insulating film,
wherein the opening reaches the fourth insulating film.
12. The semiconductor device according to claim 10 , wherein
a melting point of the fourth insulating film is lower than a melting point of the second insulating film.
13. The semiconductor device according to claim 5 , wherein a part of a lower surface of the fuse is covered by the third insulating film in the gap.
14. The semiconductor device according to claim 5 , further comprising a fifth insulating film, which has a melting point higher than a melting point of the third insulating film, formed on the second insulating film.