IP Library Granted Patent US 8,823,461
Granted Patent B2
US 8,823,461 · App. 13/607,732 · Granted Sep 2, 2014

Microwave adaptors and related oscillator systems

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Quick Facts
Patent No.
US 8,823,461
App. No.
13/607,732
Granted
Sep 2, 2014
Kind
B2
Abstract

An adaptor for a solid-state oscillator and related microwave adaptors includes an input segment of a conductive material, a first coaxial portion that includes a first inner conductor coupled to the input segment and a first outer shielding segment, and a capping portion coupled to the first coaxial portion to electrically couple the first inner conductor and the first outer shielding segment.

Claims (63)

1. An adaptor, comprising:

an input segment of a conductive material;

a first coaxial portion including a first inner conductor coupled to the input segment and a first outer shielding segment; and

a capping portion coupled to the first coaxial portion to electrically couple the first inner conductor and the first outer shielding segment, wherein the capping portion is disposed within a hollow region defined by the first outer shielding segment.

2. The adaptor of claim 1 , wherein the capping portion includes an air gap aligned with an end of the first inner conductor.

3. An adaptor, comprising:

an input segment of a conductive material;

a first coaxial portion including a first inner conductor coupled to the input segment and a first outer shielding segment;

a second coaxial portion including a second inner conductor coupled between the input segment and the first inner conductor, wherein a diameter of the second coaxial portion is different from a diameter of the first coaxial portion; and

a capping portion coupled to the first coaxial portion to electrically couple the first inner conductor and the first outer shielding segment.

4. An adaptor, comprising:

an input segment of a conductive material;

a first coaxial portion including a first inner conductor coupled to the input segment and a first outer shielding segment;

a second coaxial portion including a second inner conductor coupled between the input segment and the first inner conductor, wherein an impedance of the second coaxial portion is different from an impedance of the first coaxial portion; and

a capping portion coupled to the first coaxial portion to electrically couple the first inner conductor and the first outer shielding segment.

5. An adaptor, comprising:

an input segment of a conductive material;

a first coaxial portion including a first inner conductor coupled to the input segment and a first outer shielding segment;

a capping portion coupled to the first coaxial portion to electrically couple the first inner conductor and the first outer shielding segment; and

a capacitive element coupled between the input segment and a reference voltage node.

6. An adaptor, comprising:

an input segment of a conductive material, wherein the input segment comprises a microstrip transmission line;

a first coaxial portion including a first inner conductor coupled to the input segment and a first outer shielding segment; and

a capping portion coupled to the first coaxial portion to electrically couple the first inner conductor and the first outer shielding segment.

7. An adaptor, comprising:

a first coaxial portion having a first diameter;

a second coaxial portion having a second diameter, wherein the second diameter is different from the first diameter, the second coaxial portion including an inner conductive portion and an outer shielding segment; and

a capping portion coupled to the second coaxial portion to electrically couple the inner conductive portion and the outer shielding segment.

8. The adaptor of claim 7 , further comprising:

a segment of conductive material coupled to the first coaxial portion; and

a capacitive element coupled between the segment of conductive material and a reference voltage node.

9. The adaptor of claim 8 , wherein the first diameter is greater than the second diameter.

10. The adaptor of claim 8 , wherein the segment is connected to an inner conductive portion of the first coaxial portion.

11. The adaptor of claim 7 , the inner conductive portion of the second coaxial portion having the second diameter, wherein the first coaxial portion includes a second inner conductive portion having the first diameter.

12. The adaptor of claim 7 , wherein:

the first coaxial portion includes a second inner conductive portion and a first dielectric portion surrounding the second inner conductive portion;

the first dielectric portion has the first diameter;

the second coaxial portion includes a second dielectric portion surrounding the inner conductive portion; and

the second dielectric portion has the second diameter.

13. The adaptor of claim 12 , wherein the first diameter is greater than the second diameter.

14. The adaptor of claim 7 , wherein the capping portion includes an opening aligned with the inner conductive portion to provide an air gap at an end of the inner conductive portion.

15. The adaptor of claim 14 , wherein:

the outer shielding segment defines a hollow region having an extending portion of the inner conductive portion disposed therein;

the capping portion includes a cylindrical portion of conductive material disposed within the hollow region;

the extending portion of the inner conductive portion is disposed within the opening in the cylindrical portion; and

the cylindrical portion contacts the inner conductive portion and the outer shielding segment.

16. The adaptor of claim 7 , wherein an impedance of the first coaxial portion is different from an impedance of the second coaxial portion.

17. An oscillator system, comprising:

a waveguide having an input impedance;

an oscillator arrangement to generate an oscillating signal at a first node; and

an adaptor coupled to the first node, the adaptor comprising:

an input segment of conductive material coupled to the first node;

an antenna portion disposed within the waveguide; and

one or more coaxial portions coupled between the antenna portion and the input segment to translate the oscillating signal to the input impedance of the waveguide at the antenna portion.

18. The oscillator system of claim 17 , further comprising a capacitive element coupled between the input segment and a reference voltage node, wherein:

an impedance of the input segment corresponds to an output impedance at the first node; and

the one or more coaxial portions are configured to translate the oscillating signal from the output impedance to the input impedance of the waveguide.

19. The oscillator system of claim 17 , wherein the one or more coaxial portions comprise:

a first coaxial portion having a first inner conductor coupled to the input segment; and

a second coaxial portion having a second inner conductor coupled to the first inner conductor, wherein a diameter of the first inner conductor is different from a diameter of the second inner conductor.

20. The oscillator system of claim 17 , wherein the oscillator arrangement comprises:

a first amplifier having a first amplifier input and a first amplifier output coupled to the first node; and

an annular resonance structure coupled between the first amplifier output and the first amplifier input.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
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MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
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From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2012
From: SHI, TIEFENG; LI, JUN
To: FREESCALE SEMICONDUCTOR, INC.
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