IP Library Granted Patent US 9,162,414
Granted Patent B2
US 9,162,414 · App. 13/608,360 · Granted Oct 20, 2015

Method for preparing a scored flexible structure, and method for making a flexible packaging structure having a built-in open and reclose feature

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,162,414
App. No.
13/608,360
Granted
Oct 20, 2015
Kind
B2
Abstract

A method for preparing a scored flexible structure that has utility in the construction of packaging structures, including steps of: (i) providing a structure as a web of flexible material; (ii) enhancing a thickness of the structure in a discrete region thereof by applying a substantially all-solids electron-beam-curable polymer material in fluid form onto the discrete region, the discrete region occupying a minor percentage of a total surface area of the structure; (iii) curing the polymer material by irradiating the polymer material with an electron beam, thereby forming an EB-cured polymer region; and (iv) forming a score line through a thickness of the EB-cured polymer region and through the thickness of the structure.

Claims (10)

1. A flexible packaging structure having a built-in open and reclose feature, comprising:

a laminate comprising a first structure adhesively laminated to a second structure, the first structure comprising a web of flexible material and the second structure comprising a web of flexible material;

an EB-cured polymer region formed on the first structure for enhancing a thickness of the first structure in a discrete region thereof, the discrete region occupying a minor percentage of a total surface area of the first structure and corresponding to a desired location of the built-in open and reclose feature to be formed, the EB-cured polymer region being formed by applying a substantially all-solids electron-beam-curable polymer material in fluid form onto the discrete region and curing the polymer material by irradiating the polymer material with an electron beam, wherein the EB-cured polymer region is applied to a surface of the first structure opposite a surface of the first structure to which the second structure is laminated;

a first score line formed through a thickness of the EB-cured polymer region and through the thickness of the first structure so as to create a first flap in the first structure, the first flap being movable out of a plane of the first structure to create an opening through the first structure;

a second score line formed in the second structure so as to create a second flap in the second structure, the second flap being movable out of a plane of the second structure to create an opening through the second structure, the second flap having a smaller footprint than the first flap;

wherein the first and second flaps are placed in registration and adhesively joined together so that a marginal region of the first flap extends beyond a periphery of the second flap, and wherein the adhesive includes at least a pressure-sensitive adhesive that is positioned to adhere the marginal region of the first flap to an underlying surface of the second structure.

2. The flexible packaging structure of claim 1 , wherein each of the first and second score lines is formed to be generally U-shaped such that each of the first and second flaps remains attached to the laminate along a hinge extending between legs of the respective score line.

3. The flexible packaging structure of claim 1 , wherein a surface of the first structure facing the second structure is treated with a corona or flame treatment to enhance bonding affinity with the pressure-sensitive adhesive such that the pressure-sensitive adhesive tends to remain adhered to the marginal region of the first flap and to detach from the underlying surface of the second structure when the flaps are peeled back.

4. The flexible packaging structure of claim 1 , wherein the first structure is provided to be formed of a material that has a greater bonding affinity to the pressure-sensitive adhesive than does the second structure, such that the pressure-sensitive adhesive tends to remain adhered to the marginal region of the first flap and to detach from the underlying surface of the second structure when the flaps are peeled back.

5. The flexible packaging structure of claim 4 , wherein the first structure is provided to be formed of polyester and the second structure is provided to have a layer of polyolefin forming the underlying surface to which the pressure-sensitive adhesive is attached and re-attached.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2025
From: SONOCO DEVELOPMENT, INC.
To: TOPPAN PACKAGING AMERICAS HOLDINGS, INC.
Reel/Frame 071338/0486 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2012
From: HUFFER, SCOTT W.; PETTIS, ROD
To: SONOCO DEVELOPMENT, INC.
Reel/Frame 028927/0348 →