Method for manufacturing antenna structure
A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.
1. A method for manufacturing an antenna structure, the method comprising the steps of:
providing a non-conductive frame containing a catalyst;
disposing a metal insert in an area of the non-conductive frame;
forming an anti-plating resistance layer covering a surface of the non-conductive frame;
removing the anti-plating resistance layer on the area of the non-conductive frame by a laser-direct-structuring (LDS) technique, and forming a coarsened surface in the area;
removing the anti-plating resistance layer on the surface of the non-conductive frame; and
forming a metal layer on the coarsened surface to obtain the antenna structure in contact with the metal insert.
2. The method of claim 1 , wherein the step of providing the non-conductive frame containing the catalyst comprises:
injecting a plastic containing the catalyst into a mold to form the non-conductive frame.
3. The method of claim 1 , wherein the catalyst is uniformly dispersed in the non-conductive frame.
4. The method of claim 1 , wherein the catalyst is clustered on the surface of the non-conductive frame.
5. The method of claim 1 , wherein the non-conductive frame containing the catalyst comprises a non-conductive layer free of the catalyst.
6. The method of claim 1 , wherein the metal insert penetrates the non-conductive frame.
7. The method of claim 1 , wherein the metal insert does not penetrate the non-conductive frame.
8. The method of claim 1 , wherein the metal insert is a material selected from the group consisting of copper, nickel, iron, aluminum and a combination thereof.
9. The method of claim 1 , wherein the catalyst is a material selected from the group consisting of metal, an inorganic metal compound, an organic metal compound and a combination thereof.
10. The method of claim 1 , wherein the catalyst has a material selected from the group consisting of palladium, tin, copper, iron, silver, gold and any combination thereof.
11. The method of claim 1 , wherein the anti-plating resistance layer comprises a resin.
12. The method of claim 1 , wherein the step of forming the anti-plating resistance layer on the non-conductive frame is employing a dipping method or a spraying method.
13. The method of claim 1 , wherein the metal layer is a material selected from the group consisting of copper, nickel, iron, aluminum and a combination thereof.
14. The method of claim 1 , wherein the step of forming the metal layer comprises electroless plating the metal layer on the surface of the non-conductive frame.
15. The method of claim 1 , further comprising a step of increasing the thickness of the metal layer by using a depositing method.
16. The method of claim 15 , wherein the depositing method is an electroplating process or an electroless plating process.
17. The method of claim 1 , wherein the step of providing the non-conductive frame containing the catalyst further comprises:
disposing the metal insert in the mold; and
injecting a plastic containing the catalyst into a mold to form the non-conductive frame.
18. The method of claim 1 , wherein the step of providing the non-conductive frame containing the catalyst further comprises:
injecting a plastic containing the catalyst into a mold to form the non-conductive frame; and
embedding the metal insert in the non-conductive frame containing the catalyst.