IP Library Granted Patent US 9,099,429
Granted Patent B2
US 9,099,429 · App. 13/609,571 · Granted Aug 4, 2015

Heat sink

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Quick Facts
Patent No.
US 9,099,429
App. No.
13/609,571
Granted
Aug 4, 2015
Kind
B2
Abstract

There is provided a heat sink including: a heat radiation plate having a heating element fixed to one surface thereof; a plurality of heat radiation fins formed on the other surface of the heat radiation plate to radiate heat generated in the heating element; a flange part provided on a heat radiation fin positioned in an outermost position among the plurality of heat radiation fins; and a fixing member inserted into the flange part to fix the heat sink to a printed circuit board, wherein the flange part is compressed in a predetermined position thereof, such that the fixing member and the flange part are coupled and fixed to each other.

Claims (13)

1. A heat sink comprising:

a heat radiation plate having a heating element fixed to one surface thereof;

a plurality of heat radiation fins formed on the other surface of the heat radiation plate to radiate heat generated in the heating element;

a flange part provided on a heat radiation fin positioned in an outermost position among the plurality of heat radiation fins; and

a fixing member inserted into the flange part to fix the heat sink to a printed circuit board, the flange part compressed in a predetermined position thereof such that the fixing member and the flange part are coupled and fixed to each other, and the fixing member including

a flat part having a flat plate shape and inserted into the flange part, and

a coupling part extended upwardly from the flat part in a vertical direction to be coupled to the printed circuit board and having a width smaller than that of the flat part, the coupling part including

a protrusion part fixing the heat sink and the printed circuit board to each other by forming a coupling therebetween, and

a support part supporting the heat sink such that the heat sink is coupled to the printed circuit board while being spaced apart from the printed circuit board by a predetermined interval.

2. The heat sink of claim 1 , wherein the flange part is extended from an upper portion of the heat radiation plate and a free end of the heat radiation fin positioned in the outermost position among the plurality of heat radiation fins so as to face the heat radiation fin positioned in the outermost position among the plurality of heat radiation fins.

3. The heat sink of claim 1 , wherein the flange part is extended in a length direction of the heat radiation fin.

4. The heat sink of claim 1 , wherein after the fixing member is inserted into the flange part and then moved to the predetermined position in the flange part, the flange part is compressed in the predetermined position thereof, such that the fixing member and the flange part are coupled and fixed to each other.

5. The heat sink of claim 1 , wherein one surface of the heat radiation plate opposite to the other surface of the heat radiation plate on which the heat radiation fins are formed, is provided with at least one fastening hole to allow the heating element to be fixed thereto.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SOLUM CO., LTD.
Reel/Frame 048203/0117 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2012
From: YOON, JOO WON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 029025/0207 →