Electrochromic devices
View Patent ↗Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices.
1. An apparatus for fabricating an electrochromic device, comprising:
(a) an integrated deposition system comprising:
(i) a first deposition station containing a first target comprising a first material for depositing a layer of an electrochromic material on a substrate when the substrate is positioned in the first deposition station, and
(ii) a second deposition station containing a second target comprising a second material for depositing a layer of a counter electrode material on the substrate when the substrate is positioned in the second deposition station; and
(b) a controller containing program instructions provided on a non-transitory medium for passing the substrate through the first and second deposition stations in a manner that sequentially deposits a stack on the substrate, the stack comprising the layer of electrochromic material in direct contact with the layer of counter electrode material, without an ion conducting layer between the layer of electrochromic material and the layer of counter electrode material.
2. The apparatus of claim 1 , operable to pass the substrate from one station to the next without breaking vacuum.
3. The apparatus of claim 1 , wherein the integrated deposition system further comprises one or more lithiation stations operable to deposit lithium from a lithium-containing material source on at least one of the electrochromic layer and the counter electrode layer.
4. The apparatus of claim 3 , further comprising at least one slit valve operable to permit isolation of said one or more lithiation stations from at least one of the first deposition station and the second deposition station.
5. The apparatus of claim 1 , wherein the integrated deposition system is operable to deposit the stack on an architectural glass substrate.
6. The apparatus of claim 1 , wherein the integrated deposition system further comprises a substrate holder and transport mechanism configured to hold the substrate in a substantially vertical orientation while passing through the integrated deposition system.
7. The apparatus of claim 6 , wherein the substrate holder and transport mechanism are configured to hold an architectural glass substrate.
8. The apparatus of claim 6 , wherein the substrate holder and transport mechanism are configured to move substrate in a forward and backward motion path in front of the first target and/or the second target during deposition of the layer of electrochromic material and/or the layer of counter electrode material.
9. The apparatus of claim 1 , further comprising one or more load locks for passing the substrate between an external environment and the integrated deposition system.
10. The apparatus of claim 1 , wherein the integrated deposition system comprises one or more heaters configured to heat the substrate and one or more cooling components configured to cool, actively or passively, the substrate.
11. The apparatus of claim 1 , wherein the integrated deposition system does not contain a separate target comprising material for an ion conductor layer.
12. The apparatus of claim 1 , wherein the apparatus does not have a separate station for depositing an ion conducting layer between the layer of electrochromic material and the layer of counter electrode material.
13. The apparatus of claim 1 , wherein the first deposition station is adjacent to the second deposition station.