IP Library Granted Patent US 8,653,566
Granted Patent B2
US 8,653,566 · App. 13/611,953 · Granted Feb 18, 2014

Solid-state imaging device

Inventor: Hirohisa Ohtsuki (Toyama, JP)
Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 8,653,566
App. No.
13/611,953
Granted
Feb 18, 2014
Kind
B2
Abstract

The present invention provides a solid-state imaging device in which high S/N is achieved. A solid-state imaging device includes a photodiode, a transfer transistor, a floating diffusion, a floating diffusion wiring, an amplifying transistor, a power line, and first output signal lines, in which the first output signal lines are formed one on each side of the floating diffusion wiring in a layer having the floating diffusion wiring formed on a semiconductor substrate, and the power line is formed above the floating diffusion wiring.

Claims (16)

1. A solid-state imaging device comprising:

a photodiode that is formed in a semiconductor substrate and stores electric charges according to an amount of light received;

a transfer transistor that reads out the electric charges from the photodiode;

a floating diffusion to which the electric charges read out by the transfer transistor is transferred;

a floating diffusion wiring connected to the floating diffusion;

an amplifying transistor having a gate connected to the floating diffusion wiring;

a power line connected to one of a drain and a source of the amplifying transistor; and

a first output signal line connected to the other of the drain and the source of the amplifying transistor,

wherein the first output signal line includes a first wiring, a second wiring, and a third wiring in a layer having the floating diffusion wiring formed on the semiconductor substrate, the first wiring and the second wiring being formed on the separate sides of the floating diffusion wiring, and the third wiring connecting the first wiring and the second wiring, and

the power line is formed above the floating diffusion wiring.

2. The solid-state imaging device according to claim 1 ,

wherein the first output signal line further includes a fourth wiring that connects the first wiring and the second wiring, and

the floating diffusion wiring is surrounded by the first wiring, the second wiring, the third wiring, and the fourth wiring.

3. The solid-state imaging device according to claim 1 , wherein the first output signal line is connected to a second output signal line formed between the floating diffusion wiring and the power line.

4. The solid-state imaging device according to claim 1 , wherein the floating diffusion wiring is longer in height than in width.

5. The solid-state imaging device according to claim 1 , wherein a distance between the floating diffusion wiring and the first output signal line is longer than a distance between the floating diffusion wiring and the power line.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: OHTSUKI, HIROHISA
To: PANASONIC CORPORATION
Reel/Frame 029485/0388 →
Priority Claims (1)
JP 2010-066800 · Mar 23, 2010 · national
Continuity (2)
Continuation PCTJP2010007267 · Dec 15, 2010
Related Publication 20130001650A1 · Jan 3, 2013