IP Library Granted Patent US 8,809,906
Granted Patent B2
US 8,809,906 · App. 13/613,177 · Granted Aug 19, 2014

Semiconductor optical device

Inventors: Lei Zhu (Atsugi, JP); Shigeaki Sekiguchi (Zama, JP); Shinsuke Tanaka (Hiratsuka, JP); Kenichi Kawaguchi (Ebina, JP)
Assignee: Fujitsu Limited
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,809,906
App. No.
13/613,177
Granted
Aug 19, 2014
Kind
B2
Abstract

A semiconductor optical device includes a first clad layer, a second clad layer and an optical waveguide layer sandwiched between the first clad layer and the second clad layer, wherein the optical waveguide layer includes a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer and extending in one direction, and a third semiconductor layer covering a top surface of the second semiconductor layer, and wherein the first semiconductor layer includes an n-type region disposed on one side of the second semiconductor layer, a p-type region disposed on the other side of the second semiconductor layer, and an i-type region disposed between the n-type region and the p-type region, and wherein the second semiconductor layer has a band gap narrower than band gaps of the first semiconductor layer and the third semiconductor layer.

Claims (31)

1. A semiconductor optical device comprising:

a first clad layer, a second clad layer and an optical waveguide layer sandwiched between the first clad layer and the second clad layer,

wherein the optical waveguide layer includes a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer and extending in one direction, and a third semiconductor layer covering a top surface of the second semiconductor layer, and

wherein the first semiconductor layer includes an n-type region disposed on one side of the second semiconductor layer, a p-type region disposed on the other side of the second semiconductor layer, an i-type region disposed between the n-type region and the p-type region, and a p-i-n homojunction to which a forward voltage is applied and which includes the p-type region and the i-type region and the n-type region, and

wherein the second semiconductor layer has a band gap narrower than band gaps of the first semiconductor layer and the third semiconductor layer, and

wherein the band gap of the second semiconductor layer is set so that an absolute value of a variation of an equivalent refractive index of a three-layered rib portion including the second semiconductor layer, the third semiconductor layer and the first semiconductor layer on a lower side of the second semiconductor layer, which is produced by carrier injection into the three-layered rib portion, is larger than an absolute value of a variation of an equivalent refractive index of a two-layered rib portion which includes the second semiconductor layer and the first semiconductor layer on a lower side of the second semiconductor layer and has an identical size to the three-layered rib portion, which is produced by carrier injection into the two-layered rib portion.

2. The semiconductor optical device according to claim 1 ,

wherein the third semiconductor layer further covers side faces of the second semiconductor layer.

3. The semiconductor optical device according to claim 1 , further comprising:

a groove disposed on the i-type region,

wherein the second semiconductor layer is disposed on the groove, and at least a portion of side faces thereof contacts to the i-type region.

4. The semiconductor optical device according to claim 1 ,

wherein the first semiconductor layer is thinner than a region thereof contacting to the second semiconductor layer on both sides of the second semiconductor layer.

5. The semiconductor optical device according to claim 1 ,

wherein the first semiconductor layer and the third semiconductor layer are single-crystal silicon layers, and

wherein the second semiconductor layer is a single-crystal silicon germanium layer.

6. The semiconductor optical device according to claim 5 ,

wherein a composition ratio of germanium in the second semiconductor layer is greater than 0 and not greater than 0.35.

7. The semiconductor optical device according to claim 5 ,

wherein the first semiconductor layer, the second semiconductor layer and the third semiconductor layer have a (110) plane direction.

8. A semiconductor optical device comprising:

a first clad layer, a second clad layer and an optical waveguide layer sandwiched between the first clad layer and the second clad layer,

wherein the optical waveguide layer includes a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer and extending in one direction, and a third semiconductor layer covering a top surface of the second semiconductor layer, and

wherein the first semiconductor layer includes an n-type region, a p-type region contacting to the n-type region and having a boundary with the n-type region extending in the one direction, and a pn homojunction to which a forward voltage is applied and which includes the p-type region and the n-type region, and

wherein the second semiconductor layer is disposed on the boundary and has a band gap narrower than band gaps of the first semiconductor layer and the third semiconductor layer, and

wherein the band gap of the second semiconductor layer is set so that an absolute value of a variation of an equivalent refractive index of a three-layered rib portion including the second semiconductor layer, the third semiconductor layer and the first semiconductor layer on a lower side of the second semiconductor layer, which is produced by carrier injection into the three-layered rib portion, is larger than an absolute value of a variation of an equivalent refractive index of a two-layered rib portion which includes the second semiconductor layer and the first semiconductor layer on a lower side of the second semiconductor layer and has an identical size to the three-layered rib portion, which is produced by carrier injection into the two-layered rib portion.

9. The semiconductor optical device according to claim 8 ,

wherein the first semiconductor layer and the third semiconductor layer are single-crystal silicon layers, and

wherein the second semiconductor layer is a single-crystal silicon germanium layer.

10. The semiconductor optical device according to claim 8 ,

wherein the first semiconductor layer, the second semiconductor layer and the third semiconductor layer have a (110) plane direction.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 15, 2022
From: FUJITSU LIMITED
To: FUJITSU OPTICAL COMPONENTS LIMITED
Reel/Frame 060804/0905 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2012
From: ZHU, LEI; SEKIGUCHI, SHIGEAKI; TANAKA, SHINSUKE; KAWAGUCHI, KENICHI
To: FUJITSU LIMITED
Reel/Frame 029083/0655 →
Priority Claims (1)
JP 2011-254445 · Nov 21, 2011 · national
Continuity (1)
Related Publication 20130126941A1 · May 23, 2013