E-field shield for wireless charger
View Patent ↗A shielding arrangement for preventing AM radio interference when a wireless charger is used in a vehicle has a plurality of parallel conductors arranged at a distance from one another responsive to a frequency desired to be attenuated. An interconnection arrangement includes a solid conductive junction and connects the conductors to one another without forming loops, and to ground. The conductors are traces disposed on a PCB. Additional parallel conducts are disposed on the other side of the PCB at an orthogonal orientation with respect to the first conductors. The spacing between the conductors is determined in response to the frequency desired to be attenuated, as well as frequencies thereabove that are desired to be propagated therethrough, such as mobile telephone signals. The solid conductive junction that is disposed on the printed circuit board is electrically and thermally conductive, such as copper.
1. A shielding arrangement for attenuating electromagnetic energy generated by a primary coil of a charging device, the shielding arrangement comprising:
a printed circuit board having first and second sides;
a first plurality of substantially parallel conductors disposed on the first side of the printed circuit board and arranged at a first predetermined uniform lateral distance from one another;
a second plurality of substantially parallel conductors disposed on the second side of the printed circuit board and arranged at a second predetermined uniform lateral distance from one another, wherein the first and second plurality of substantially parallel conductors are separated from each other only by the printed circuit board;
the first and second predetermined lateral distances selected so that electromagnetic energy of a predetermined frequency generated by the primary coil is attenuated when propagating through the shielding arrangement;
a first interconnection arrangement for electrically connecting said first plurality of substantially parallel conductors to one another;
a second interconnection arrangement for electrically connecting said second plurality of substantially parallel conductors to one another; and
the first and second interconnection arrangements formed on opposite sides of the printed circuit board.
2. The shielding arrangement of claim 1 , wherein said plurality of first and second substantially parallel conductors are formed as conductive traces disposed on the first and second sides of said printed circuit board, respectively.
3. The shielding arrangement of claim 2 , wherein said first and second interconnection arrangements comprise a respective solid conductive junction disposed on respective sides of said printed circuit board.
4. The shielding arrangement of claim 3 , wherein, said first plurality of substantially parallel conductors have a predetermined angular orientation with respect to said second plurality of substantially parallel conductors.
5. The shielding arrangement of claim 4 , wherein the predetermined angular orientation is a substantially orthogonal angular orientation.
6. The shielding arrangement of claim 4 , wherein said first and second predetermined lateral distances are equal.
7. The shielding arrangement of claim 3 , wherein said respective solid conductive junction disposed on said printed circuit board is configured to conduct heat.
8. The shielding arrangement of claim 3 , wherein said respective solid conductive junction disposed on said printed circuit board is formed of a material that is electrically and thermally conductive.
9. The shielding arrangement of claim 8 , wherein said respective solid conductive junction disposed on said printed circuit board is formed of a metallic material that contains copper.