Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

1. A chip stack of semiconductor chips with enhanced cooling comprising:

a first chip with circuitry on a first side;

a second chip electrically and mechanically coupled to the first chip by a grid of connectors; and

a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes:

a first plurality of magnetized nanofibers that are aligned parallel to mating surfaces of the first chip and the second chip and are aligned perpendicular to nearest first and second sides of the thermal interface material pad, wherein the first and second sides of the thermal interface material pad are opposing sides that extend perpendicular to the mating surfaces;

a second plurality of magnetized nanofibers that are aligned parallel to the mating surfaces of the first chip and the second chip and are aligned perpendicular to nearest third and fourth sides of the thermal interface material pad, wherein the third and fourth sides of the thermal interface material pad are opposing sides that extend perpendicular to the mating surfaces and extend perpendicular to the first and second sides; and

a third plurality of magnetized nanofibers that are aligned perpendicular to the mating surfaces of the first chip and the second chip.

2. The chip stack of claim 1 , wherein the first plurality of magnetized nanofibers draw heat from the first chip and the second chip toward the first and second sides of the thermal interface material pad, the second plurality of magnetized nanofibers draw heat from the first chip and the second chip toward the third and fourth sides of the thermal interface material pad, and the third plurality of magnetized nanofibers is a vertical heat transmission channel between the mating surfaces of the first chip and the second chip.

3. The chip stack of claim 2 , wherein the vertical heat transmission channel is formed by localized heating of an area in the thermal interface material pad to produce a heated area and using a magnetic mask to align nanofibers in the heated area to be perpendicular to the mating surfaces of the first chip and the second chip.

4. The chip stack of claim 2 , wherein the vertical heat transmission channel is formed by cutting a block of thermal interface material into pieces with aligned nanofibers, and assembling the pieces of the thermal interface material into the thermal interface material pad.

5. The chip stack of claim 1 , wherein the nanofibers are nanotubes.

6. The chip stack of claim 1 , wherein the thermal interface material pad is divided into a first region comprising the first side, a second region comprising the second side, a third region comprising the third side, a fourth region comprising the fourth side, and a central region comprising a central portion of the thermal interface material pad adjacent to the first, second, third, and fourth regions.

7. A chip stack of semiconductor chips with enhanced cooling comprising:

a first chip with circuitry on a first side;

a second chip electrically and mechanically coupled to the first chip by a grid of connectors;

a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes:

a first set of nanofibers aligned parallel to mating surfaces of the first chip and the second chip and aligned perpendicular to a second set of nanofibers, wherein the first set of nanofibers are aligned perpendicular to nearest first and second sides of the thermal interface material pad, the first and second sides of the thermal interface material pad are opposing sides that extend perpendicular to the mating surfaces, the second set of nanofibers are aligned parallel to the mating surfaces of the first chip and the second chip, the second set of nanofibers are aligned perpendicular to nearest third and fourth sides of the thermal interface material pad, and the third and fourth sides of the thermal interface material pad are opposing sides that extend perpendicular to the mating surfaces;

a third set of nanofibers aligned perpendicular to the mating surfaces of the first chip and the second chip and aligned perpendicular to the first set of nanofibers and the second set of nanofibers;

a first pair of heatsinks connected to the chip stack, wherein the first pair of heatsinks are connected to the thermal interface material pad on the conductive axis of the first set of nanofibers in the thermal interface material pad; and

a second pair of heatsinks connected to the chip stack, wherein the second pair of heatsinks are connected to the thermal interface material pad on the conductive axis of the second set of nanofibers in the thermal interface material pad.

8. The chip stack of claim 7 , wherein the nanofibers are nanotubes.

9. The chip stack of claim 6 , wherein the first plurality of magnetized nanofibers comprises substantially all magnetized nanofibers within the first and second regions, and the second plurality of magnetized nanofibers comprises substantially all magnetized nanofibers within the second and third regions.

10. The chip stack of claim 9 , wherein the central region comprises the third plurality of magnetized nanofibers.

11. The chip stack of claim 7 , wherein the thermal interface material pad is divided into a first region comprising the first side, a second region comprising the second side, a third region comprising the third side, a fourth region comprising the fourth side, and a central region comprising a central portion of the thermal interface material pad adjacent to the first, second, third, and fourth regions.

12. The chip stack of claim 11 , wherein the first set of nanofibers comprises substantially all nanofibers within the first and second regions, and the second set of nanofibers comprises substantially all nanofibers within the second and third regions.

13. The chip stack of claim 12 , wherein the central region comprises the third set of nanofibers.