Crystallization apparatus, crystallization method, method of manufacturing thin film transistor and method of manufacturing organic light emitting display apparatus

1. A crystallization method, comprising:

providing a crystallization chamber, wherein the crystallization chamber comprises a first flash lamp and a second flash lamp facing the first flash lamp;

providing a substrate, the substrate comprising a first amorphous silicon layer on a first surface of the substrate and a second amorphous silicon layer on a second surface of the substrate, wherein the first and second surfaces face away from each other;

placing the substrate in the crystallization chamber such that the first surface faces the first flash lamp and the second surface faces the second flash lamp;

irradiating a first light beam from the first flash lamp to the first amorphous silicon layer for at least partially crystallizing the first amorphous silicon layer; and

concurrently irradiating a second light beam from the second flash lamp to the second amorphous silicon layer for at least partially crystallizing the second amorphous silicon layer.

2. The crystallization method of claim 1 , wherein the substrate comprises a first plate and a second plate, wherein the first surface is a surface of the first plate and the second surface is a surface of the second plate.

3. The crystallization method of claim 2 , further comprising separating the two plates from each other after the amorphous silicon layers are crystallized.

4. The crystallization method of claim 1 , further comprising removing at least one of the crystallized silicon layers from the substrate.

5. The crystallization method of claim 1 , further comprising dividing the substrate into two parts along a surface parallel to the first surface and the second surface after the amorphous silicon layers are crystallized.

6. A method of manufacturing a thin film transistor (TFT), the method comprising:

forming an active layer on a substrate;

forming a gate electrode insulated from the active layer; and

forming a source electrode and a drain electrode, which are electrically connected to the active layer,

wherein the forming of the active layer comprises:

providing a crystallization chamber, wherein the crystallization chamber comprises a first flash lamp and a second flash lamp facing the first flash lamp;

providing a substrate, the substrate comprising a first amorphous silicon layer on a first surface of the substrate and a second amorphous silicon layer on a second surface of the substrate, wherein the first and second surfaces face away from each other;

placing the substrate in the crystallization chamber such that the first surface faces the first flash lamp and the second surface faces the second flash lamp;

irradiating a first light beam from the first flash lamp to the first amorphous silicon layer for at least partially crystallizing the first amorphous silicon layer; and

concurrently irradiating a second light beam from the second flash lamp to the second amorphous silicon layer for at least partially crystallizing the second amorphous silicon layer.

7. A method of manufacturing an organic light emitting display apparatus, the method comprising:

forming a thin film transistor (TFT); and

forming an organic light emitting device electrically connected to the TFT,

wherein the forming of the TFT comprises:

forming an active layer on a substrate;

forming a gate electrode insulated from the active layer; and

forming a source electrode and a drain electrode, which are electrically connected to the active layer,

wherein the forming of the active layer comprises:

providing a crystallization chamber, wherein the crystallization chamber comprises a first flash lamp and a second flash lamp facing the first flash lamp;

providing a substrate, the substrate comprising a first amorphous silicon layer on a first surface of the substrate and a second amorphous silicon layer on a second surface of the substrate, wherein the first and second surfaces face away from each other;

placing the substrate in the crystallization chamber such that the first surface faces the first flash lamp and the second surface faces the second flash lamp;

irradiating a first light beam from the first flash lamp to the first amorphous silicon layer for at least partially crystallizing the first amorphous silicon layer; and

concurrently irradiating a second light beam from the second flash lamp to the second amorphous silicon layer for at least partially crystallizing the second amorphous silicon layer.