Foreign matter removal device and foreign matter removal method

1. A foreign matter removal device comprising:

a jig having a plate with through-holes formed therein and also having a frame formed on said plate so as to be able to accommodate a plurality of semiconductor chips in spaced relationship on at least a first portion of a top surface of said plate and laterally between interior side surfaces of said frame;

a foreign matter capture member having a first charge section with a first flat surface and a second charge section with a second flat surface, said second charge section being insulated from said first charge section, said first and second flat surfaces constituting a single flat surface;

charging means for positively charging said first flat surface and negatively charging said second flat surface; and

sliding means for causing either said jig or said foreign matter capture member to slide relative to the other in such a manner that said through-holes of said jig are spaced a predetermined distance from said first and second flat surfaces;

wherein said through-holes are formed in different regions defined and surrounded by said frame,

wherein at least a portion of a bottom surface of said frame is formed on at least a second portion of said top surface of said plate, and

wherein the frame has a plurality of openings, wherein each opening is provided for each of the plurality of semiconductor chips, wherein each opening has a plurality of recessed portions, wherein the plurality of recessed portions define said interior side surfaces of the frame facing each semiconductor chip, and wherein the plurality of recessed portions define a shape of each opening in plan view that is not rectangular.

2. The foreign matter removal device according to claim 1 , wherein said plate is formed of conductive material.

3. The foreign matter removal device according to claim 1 , wherein:

said semiconductor chips are rectangular as viewed in plan; and

a configuration of sides of said frame prevents surface contact between said sides of said frame and sides of said semiconductor chips when said semiconductor chips are accommodated in said frame.

4. The foreign matter removal device according to claim 3 , wherein said through-holes are formed adjacent said sides of said frame as viewed in plan.

5. The foreign matter removal device according to claim 1 , wherein said charging means has a first electrode formed below said first charge section and a second electrode formed below said second charge section.

6. The foreign matter removal device according to claim 1 , wherein said charging means is a charging member for charging said first and second flat surfaces by means of contact, friction, or rolling.

7. The foreign matter removal device according to claim 6 , wherein said charging member is secured to said jig.

8. The foreign matter removal device according to claim 6 , wherein said first and second charge sections are formed of different materials selected from a triboelectric series, and said charging member is formed of the material having a position in the triboelectric series between said materials of said first and second charge sections.

9. The foreign matter removal device according to claim 1 , further comprising:

neutralizing means for electrically neutralizing foreign matter adhering to said first and second flat surfaces; and

collecting means for collecting foreign matter that has been electrically neutralized by said neutralizing means.