IP Library Granted Patent US 9,556,371
Granted Patent B2
US 9,556,371 · App. 13/618,088 · Granted Jan 31, 2017

Homogeneous blending

Inventors: Saeed H. Mohseni (Sylvania, OH); Elizabeth K. Gramm (Clayton, MI); Deepak Mahulikar (Madison, CT)
Assignee: Fujifilm Planar Solutions, LLC
C09K3/1463C09G1/02
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,556,371
App. No.
13/618,088
Granted
Jan 31, 2017
Kind
B2
Abstract

A method of forming a colloidal dispersion includes providing a first continuous material flow, providing a second continuous material flow, combining the first and second continuous material flows, and moving a continuous flow of a colloidal dispersion in a direction downstream of the first and second continuous flows. The first continuous material flow includes one or more of a diluent (e.g., deionized water), a base, and an acid, and the second continuous material flow includes an abrasive particle solution. The first and second material flows are combined with a Reynolds number greater than about 4400 and less than about 25000 (e.g., about 7400 to about 25000). The colloidal dispersion includes the diluent, the base, the acid, and abrasive particles from the abrasive particle solution.

Claims (41)

1. A method of forming a colloidal dispersion, the method comprising:

providing a first continuous material flow comprising a diluent, a base, and an acid;

providing a second continuous material flow comprising an abrasive particle composition; and

combining the first and second continuous material flows with a Reynolds number greater than about 4400 and less than about 25000 to form a colloidal dispersion; and

moving a continuous flow of the colloidal dispersion in a direction downstream of the combined first and second continuous material flows,

wherein the abrasive particle composition has a pH above or below the isoelectric potential of the colloidal dispersion,

wherein combining the first and second material flows comprises moving the first and second continuous material flows through at least one static mixer and said combining increases or decreases the pH through the isoelectric potential of the colloidal dispersion, and

wherein the colloidal dispersion comprises the diluent, the base, the acid, and abrasive particles from the abrasive particle composition and the colloidal dispersion is substantially free of a microgel.

2. The method of claim 1 , wherein the concentration of particles in the abrasive particle composition in the second continuous material flow is about 15 percent to about 35 percent by weight.

3. The method of claim 1 , wherein the concentration of abrasive particles in the colloidal dispersion is less than about 5 percent by weight.

4. The method of claim 1 , wherein the diluent comprises deionized water.

5. The method of claim 1 , wherein the acid comprises an organic acid.

6. The method of claim 1 , wherein the acid comprises one or more of the following: carboxylic acid, malonic acid, and hydrochloric acid.

7. The method of claim 1 , wherein the base comprises one or more of the following: potassium hydroxide, ammonium hydroxide, and quaternary ammonium.

8. The method of claim 1 , wherein the continuous colloidal dispersion has a pH of between about 8 to about 12.

9. The method of claim 1 , wherein the colloidal dispersion further comprises one or more of the following: a corrosion inhibitor, an oxidizer, and a surfactant.

10. The method of claim 9 , wherein the colloidal dispersion further comprises hydrogen peroxide.

11. The method of claim 1 , wherein the abrasive particle composition comprises one or more of the following: silica, ceria, and alumina.

12. The method of claim 1 , wherein the abrasive particle composition is a colloidal silica aqueous composition.

13. The method of claim 1 , wherein providing a first continuous material flow comprises adding a base solution having a base concentration of at least about 15% by weight to a continuous flow comprising a diluent.

14. The method of claim 13 , wherein the continuous flow of colloidal dispersion moving downstream has a concentration of the base of less than about 10% by weight.

15. The method of claim 14 , wherein the continuous flow of colloidal dispersion moving downstream has a concentration of the base of less than about 1% by weight.

16. The method of claim 1 , wherein providing the first continuous material flow comprises adding an acid solution having an acid concentration of at least about 15% by weight to a continuous flow comprising a diluent.

17. The method of claim 16 , wherein the continuous flow of colloidal dispersion moving downstream has a concentration of the acid of less than about 10% by weight.

18. The method of claim 17 , wherein the continuous flow of colloidal dispersion moving downstream has a concentration of the acid of less than about 1% by weight.

19. The method of claim 1 , wherein the Reynolds number for combining the first and second continuous material flows is about 7400 to about 25000.

20. The method of claim 1 , wherein the concentration of the acid in the first continuous material flow is less than about 10% by weight.

21. The method of claim 1 , wherein the concentration of the base in the first continuous material flow is less than about 10% by weight.

22. The method of claim 1 , wherein providing the first continuous material flow comprises diluting a continuous flow of the base or the acid upstream of the combined first and second continuous material flow.

23. The method of claim 1 , wherein providing the second continuous material flow comprises diluting the abrasive particle composition upstream of the combined first and second continuous material flows.

24. A method of forming a colloidal dispersion, the method comprising:

providing a first continuous material flow comprising a diluent, an acid, and a base;

providing a second continuous material flow comprising an abrasive particle composition; and

forming a colloidal dispersion based at least in part on combining the first and second continuous material flows with a Reynolds number greater than about 4400 and less than about 25000,

wherein the colloidal dispersion comprises the diluent, the base, the acid, and the abrasive particles, the colloidal dispersion is substantially free of a microgel, the second continuous material feed has a pH above or below the isoelectric potential of the colloidal dispersion, and the combining the first and second continuous material flows comprises moving the first and second continuous material flows through at least one static mixer and the combination of the first and second continuous material flows increases or decreases the pH of the second material flow through the isoelectric potential of the colloidal dispersion.

25. The method of claim 24 , wherein the isoelectric potential of the colloidal dispersion is at a pH of about 4.

26. The method of claim 25 , wherein the second continuous material flow has a pH of about 7.

27. The method of claim 26 , wherein the combined first and second continuous material flows has a pH of less than 3.

28. The method of claim 27 , wherein the colloidal dispersion has a pH of about 8 to about 12.

29. The method of claim 24 , further comprising providing a third continuous material flow comprising one or more of a diluent, an acid, and a base, wherein forming the colloidal dispersion is based at least in part on combining the third material flow with the combined first and second material flows with a Reynolds number greater than about 4400 and less than about 25000.

30. The method of claim 29 , wherein the combination of the third continuous material flow and the combined first and second continuous material flows increases or decreases the pH of the combined first and second continuous material flows through the isoelectric potential of the colloidal dispersion.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2019
From: FUJIFILM PLANAR SOLUTIONS, LLC
To: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
Reel/Frame 048722/0800 →
CHANGE OF NAME Recorded Dec 7, 2016
From: PLANAR SOLUTIONS, LLC
To: FUJIFILM PLANAR SOLUTIONS, LLC
Reel/Frame 040837/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 25, 2012
From: MOHSENI, SAEED H.; GRAMM, ELIZABETH K.; MAHULIKAR, DEEPAK
To: PLANAR SOLUTIONS, LLC
Reel/Frame 029017/0200 →
Continuity (2)
Provisional Application 61535293 · Sep 15, 2011
Related Publication 20130067998A1 · Mar 21, 2013