Semiconductor device, semiconductor wafer and manufacturing method of semiconductor device
View Patent ↗A semiconductor device includes wiring layers formed over a semiconductor wafer, a via-layer between the wiring layers, conductive films in the wiring layers, and a via-plug in the via-layer connecting the conductive films of the wiring layers above and below, a scribe region at an outer periphery of a chip region along an edge of the semiconductor substrate and including a pad region in the vicinity of the edge, the pad region overlapping the conductive films of the plurality of wiring layers in the plan view, the plurality of wiring layers including first second wiring layers, the conductive film of the first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view, and the conductive film of the second wiring layer includes a second conductive pattern formed in a part of the pad region in a plan view.
1. A semiconductor device comprising:
a semiconductor substrate that includes a scribe region and a chip region;
a plurality of wiring layers formed over said semiconductor substrate;
a via-layer interposed between said plurality of wiring layers;
conductive films formed respectively in said plurality of wiring layers; and
a via-plug disposed in said via-layer such that said via-plug connects said conductive films of said wiring layers respectively above and below said via-layer with each other,
wherein said scribe region is located at an outer periphery of said chip region along an edge of said semiconductor substrate,
said scribe region includes a pad region in the vicinity of said edge,
said pad region overlaps with said conductive films of said plurality of wiring layers in a plan view,
said plurality of wiring layers includes a first wiring layer and a second wiring layer,
said conductive film of said first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view,
said conductive film of said second wiring layer includes a second conductive pattern formed in a part of said pad region in a plan view, and
said second conductive pattern includes a plurality of patterns that is disposed inside said pad region with a mutual separation.
2. The semiconductor device as claimed in claim 1 , wherein said second conductive pattern is formed at least at a location offset from said edge.
3. The semiconductor device as claimed in claim 1 , wherein said second conductive pattern is disposed at least along a part of an outer periphery of said pad region such that said second conductive pattern does not overlap said edge.
4. A semiconductor device comprising:
a semiconductor substrate that includes a scribe region and a chip region;
a plurality of wiring layers formed over said semiconductor substrate;
a via-layer interposed between said plurality of wiring layers;
conductive films formed respectively in said plurality of wiring layers; and
a via-plug disposed in said via-layer such that said via-plug connects said conductive films of said wiring layers respectively above and below said via-layer with each other,
wherein said scribe region is located at an outer periphery of said chip region along an edge of said semiconductor substrate,
said scribe region includes a pad region in the vicinity of said edge,
said pad region overlaps with said conductive films of said plurality of wiring layers in a plan view,
said plurality of wiring layers includes a first wiring layer and a second wiring layer,
said conductive film of said first wiring layer includes a first conductive pattern formed over an entire surface of said pad region in a plan view,
said conductive film of said second wiring layer includes a second conductive pattern formed in a part of said pad region in a plan view, and
said pad region is defined by: a first outer peripheral part opposing said edge; a second outer peripheral part reaching said edge and said first outer peripheral part; and a third peripheral part reaching said edge and said first outer peripheral part, said pad region including a first apex formed by said first outer peripheral part and said second outer peripheral part, a second apex formed by said first outer peripheral part and said third outer peripheral part, and wherein said second conductive pattern is disposed adjacent to said first apex and said second apex.
5. The semiconductor device as claimed in claim 4 , wherein said second conductive pattern has a hook shape and is disposed adjacent to said first apex or said second apex.
6. A wafer comprising:
a semiconductor substrate that includes a scribe region and a chip region defined by said scribe region;
a wiring layer formed over said semiconductor substrate;
a pad of a metal formed along a central line of said scribe region; and
a first conductive pattern, that is electrically connected to said pad and disposed at least to overlap said pad in a plan view, formed in said wiring layer; and
a second conductive pattern, that is electrically isolated from said pad and disposed at least to overlap said pad in a plan view and in separation from said first conductive pattern, formed in said wiring layer.
7. The wafer as claimed in claim 6 , wherein said first and second conductive patterns underneath said pad are formed in an area removed by a dicing blade at a time of a dicing process.
8. The wafer as claimed in claim 7 , wherein said area has a width of 15 μm-50 μm.