IP Library › Granted Patent US 8,650,747
Granted Patent B2
US 8,650,747 · App. 13/620,099 · Granted Feb 18, 2014

Electrode array assembly and method of making same

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Quick Facts
Patent No.
US 8,650,747
App. No.
13/620,099
Granted
Feb 18, 2014
Kind
B2
Abstract

A stimulation lead assembly for making a lead includes a lead body defining a central lumen extending along the lead body and multiple conductor lumens disposed circumferentially around the central lumen and extending along the lead body; electrically conductive contacts disposed along an end of the lead body with a portion of each of the conductor lumens disposed radially underneath the conductive contacts conductor wires disposed in the conductor lumens with at least one of the conductor wires electrically connected to each conductive contact; and a solid, non-conductive material disposed, at least in part, radially underneath the conductive contacts within portions of the conductor lumens not occupied by conductor wire.

Claims (28)

1. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a central lumen extending along the lead body and a plurality of conductor lumens disposed circumferentially around the central lumen and extending along the lead body;

a plurality of electrically conductive contacts disposed along an end of the lead body, wherein a portion of each of the conductor lumens is disposed radially underneath the conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is electrically connected to each conductive contact, wherein each conductor lumen comprises an occupied portion within which at least one of the conductor wires is disposed and an unoccupied portion in which none of the conductor wires is disposed, the unoccupied portion extending from an end of the conductor lumen; and

a solid, non-conductive material disposed, at least in part, radially underneath the conductive contacts and filling the unoccupied portion of at least one of the conductor lumens;

wherein the non-conductive material is thermally fused with the lead body from heat applied to the lead assembly, which heat is at a temperature to cause the non-conductive material to thermally reflow or melt.

2. The lead assembly of claim 1 , comprising a plurality of spacers disposed between adjacent pairs of the conductive contacts.

3. The lead assembly of claim 2 , wherein the spacers and the non-conductive material arc thermally fused together from heat applied to the lead assembly.

4. The lead assembly of claim 3 , wherein a material of the spacers and the non-conductive material are a same material.

5. The lead assembly of claim 3 , wherein a material of the spacers and the non-conductive material are different materials.

6. The lead assembly of claim 1 , wherein the plurality of electrically conductive contacts are located on a proximal end of the stimulation lead.

7. The lead assembly of claim 1 , wherein the plurality of electrically conductive contacts are located on a distal end of the stimulation lead.

8. The lead assembly of claim 1 , wherein the non-conductive material is Polyurethane.

9. The lead assembly of claim 1 , wherein the plurality of conductor lumens is exactly eight conductor lumens.

10. The lead assembly of claim 1 , wherein the non-conductive material fills the unoccupied portion of each of the conductor lumens.

11. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a central lumen extending along the lead body and a plurality of conductor lumens disposed circumferentially around the central lumen and extending along the lead body;

a plurality of electrically conductive contacts disposed along an end of the lead body, wherein a portion of each of the conductor lumens is disposed radially underneath the conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is electrically connected to each conductive contact; and

a solid, non-conductive material disposed, at least in part, radially underneath the conductive contacts within portions of the conductor lumens not occupied by conductor wire.

12. The lead assembly of claim 11 , wherein the non-conductive material is thermally fused with the lead body from heat applied to the lead assembly, which heat is at a temperature to cause the non-conductive material, to thermally reflow or melt.

13. The lead assembly of claim 11 , further comprising a plurality of spacers disposed between adjacent pairs of the conductive contacts.

14. The lead assembly of claim 13 , wherein the spacers and the non-conductive material are thermally fused together from heat applied to the lead assembly.

15. The lead assembly of claim 11 , wherein a material of the spacers and the non-conductive material are a same material.

16. The lead assembly of claim 11 , wherein a material of the spacers and the non-conductive material are different materials.

17. The lead assembly of claim 11 , wherein the plurality of electrically conductive contacts are located on a proximal end of the stimulation lead.

18. The lead assembly of claim 11 , wherein the plurality of electrically conductive contacts are located on a distal end of the stimulation lead.

19. The lead assembly of claim 11 , wherein the non-conductive material is thermally fused with the lead body.