Backside-thinned image sensor using Al
View Patent ↗A structure and method of manufacture is disclosed for a backside thinned imager that incorporates a conformal, Al 2 O 3 , low thermal budget, surface passivation. This passivation approach facilitates fabrication of backside thinned, backside illuminated, silicon image sensors with thick silicon absorber layer patterned with vertical trenches that are formed by etching the exposed back surface of a backside-thinned image sensor to control photo-carrier diffusion and optical crosstalk. A method of manufacture employing conformal, Al 2 O 3 , surface passivation approach is shown to provide high quantum efficiency and low dark current while meeting the thermal budget constraints of a finished standard foundry-produced CMOS imager.
1. An image sensor, comprising:
a substrate having a side and a backside wherein the backside is to receive incident light;
an array of pixels formed on the frontside, each pixel including a photosensitive region disposed within the frontside of the substrate and a metallization layers disposed over the frontside of the substrate;
an Al 2 O 3 passivation layer formed over the backside of the substrate; and,
a plurality of trenches extending from the backside towards, but not reaching, the photosensitive region, wherein the trenches are formed in both X and Y direction forming a criss-cross trench pattern, such that each pixel is further defined by the criss-cross trench pattern wherein the backside is substantially made into islands, each rising above a corresponding pixel and wherein the trench isolates each pixel from neighboring pixels; and,
wherein portions of the Al 2 O 3 passivation layer extend into the plurality of trenches.
2. The image sensor of claim 1 , wherein each of the trenches comprises an expanded etched volume at the bottom thereof, thereby defining a photoelectrons choke area.
3. The image sensor of claim 1 , wherein the substrate comprises a boron doping having gradient of increased doping concentration from the frontside towards the backside.
4. The image sensor of claim 3 , further comprising a color filter attached to the backside over the Al 2 O 3 passivation layer.
5. The image sensor of claim 4 , wherein the color filter comprises RGB and NIR filters.
6. The image sensor of claim 1 , further comprising a vacuum chamber having a bottom surface and an upper light-transparent surface, wherein the image sensor is attached to the bottom surface and a photocathode is attached to the upper light-transparent surface.
7. The image sensor of claim 1 , further comprising a vacuum chamber having a bottom surface and an upper light-transparent surface, wherein the image sensor is attached to the bottom surface and a photocathode is attached to the upper light-transparent surface.
8. The image sensor of claim 1 , further comprising a highly doped layer provided in the backside of the substrate at the interface with the Al 2 O 3 passivation layer.
9. An image sensor, comprising:
a substrate having a frontside and a backside wherein the backside is to receive incident light;
an array of pixels formed on the frontside, each pixel including a photosensitive region disposed within the frontside of the substrate;
a dielectric layer formed over the frontside of the substrate;
a metallization layers disposed in the dielectric layer;
a highly doped layer formed on top of the backside of the substrate;
an Al 2 O 3 passivation layer formed over the highly doped layer;
a plurality of trenches extending from the backside to towards, but not reaching, the photosensitive region, wherein the trenches are formed in both X and Y direction forming a criss-cross trench pattern, such that each pixel is further defined by the criss-cross trench pattern wherein the backside is substantially made into islands, each rising above a corresponding pixel and wherein trench isolates each pixel from neighboring pixels; and,
wherein portions of the Al 2 O 3 passivation layer extend into the plurality of trenches so as to coat walls of the trenches.
10. The image sensor of claim 9 , wherein the substrate comprises a boron doping having gradient of increased doping concentration from the frontside towards the backside.
11. The image sensor of claim 9 , wherein each of the trenches comprises an expanded etched volume at the bottom thereof, thereby defining a photoelectrons choke area.
12. The image sensor of claim 9 , wherein ratio of thickness of the substrate to pixel pitch exceeds about 3:1.
13. The image sensor of claim 12 , wherein thickness of the substrate less the photosensitive region exceeds 5 microns.
14. The image sensor of claim 13 , further comprising an anti-reflective coating provided over the passivation layer.
15. The image sensor of claim 9 , wherein each of the trenches has a cross-section in the form of a narrow parallel-walls trench extending from the backside towards the photosensitive region and connected to an expanded region provided proximal the photosensitive region.
16. The image sensor of claim 15 , further comprising a silicon plate defined between bottom section of the expanded region and the photosensitive region.