Metallic frame structure and LED device having the same

1. A metallic frame structure, comprising:

a metallic frame having an imaginary plane and including

a first lead frame having a protruding portion;

a second lead frame, the protruding portion extending toward the second lead frame; and

an electrically insulated region defined between the first and second lead frames;

wherein a biggest circle is defined on the imaginary plane;

wherein at least one first blind hole and at least one second blind hole are selectively formed on at least one of the first lead frame and the second lead frame, the first blind hole formed concavely on an upper surface of the metallic frame and located substantially adjacent to a circumference of the biggest circle, and the second blind hole formed in proximate to the electrically insulated region;

wherein the at least one first blind hole is distributed around the chip-mounting area that the at least one chip is mounted thereon, and the at least one second blind hole is communicated with the electrically insulated region.

2. The metallic frame structure of claim 1 , wherein the first blind hole is arc-shaped.

3. The metallic frame structure of claim 1 , wherein at least two second blind holes are respectively formed on an upper surface of the first and second lead frames in proximate to the electrically insulated region, and the second blind hole formed on the first lead frame is in position corresponding to the second blind hole formed on the second lead frame.

4. The metallic frame structure of claim 1 , wherein each corner of the protruding portion is formed with a diagonal edge, and the second blind hole is formed by etching inwardly from the corresponding diagonal edge.

5. The metallic frame structure of claim 4 , wherein the second blind hole having a semi-circular shape is formed by etching inwardly from the corresponding diagonal edge of the protruding portion.

6. The metallic frame structure of claim 5 , wherein the at least one second blind hole formed selectively on the first lead frame and the second lead frame is selected from the group consisting of large and small semi-circular blind holes.

7. The metallic frame structure of claim 1 , wherein a depth of the second blind hole is less than half thickness of the metallic frame, and the thickness of the metallic frame is defined by an upper surface and an lower surface of the metallic frame.

8. The metallic frame structure of claim 1 , wherein the metallic frame has a stepped structure formed concavely and peripherally on the bottom surface thereof.

9. The metallic frame structure of claim 8 , wherein the first and second lead frames each have at least one third blind hole formed concavely on the respective stepped structure.

10. The metallic frame structure of claim 9 , wherein the metallic frame has at least one bar protruding therefrom, and wherein two sides of the bar are substantially in position corresponding to two neighbor third blind holes.

11. The metallic frame structure of claim 1 , wherein the first and second lead frames each defines an upper groove formed concavely on the edge of the upper surface thereof proximate to the electrically insulated region, the first and second lead frames each defines a lower groove formed concavely on the edge of the lower surface thereof proximate to the electrically insulated region, and the upper and lower grooves cooperatively define a multi-segmented structure.

12. The metallic frame structure of claim 11 , wherein the uppers grooves defined by the first and second lead frames are separated by a corresponding distance greater than that of the insulated region, and the lower grooves defined by the first and second lead frames are separated by a corresponding distance greater than that between the upper grooves.

13. The metallic frame structure of claim 11 , wherein the upper grooves have an arc-shaped cross-section and the lower grooves have a straight-edged cross-section.

14. The metallic frame structure of claim 1 , wherein at least one through hole having an upper hole portion and a lower hole portion respectively exposed on an upper surface and a bottom surface of the first lead frame is penetrated through the metallic frame, and the lower hole portion is defined by a diameter greater than that of the upper hole portion.

15. The metallic frame structure of claim 1 , wherein the second lead frame has a multi-sided portion facing the protruding portion of the first lead frame.

16. An LED device, comprising:

a metallic frame defining a chip-mounting area and including a first lead frame and a second lead frame;

at least one LED chip disposed on the chip-mounting area of the metallic frame and connected electrically to the first and second lead frames; and

a packaging body having a base portion for encapsulating the metallic frame and a light-permitting portion arranged above the LED chip;

wherein the first lead frame has a protruding portion extending toward the second lead frame, and an electrically insulated region is defined between the first and second lead frames;

wherein at least one first blind hole and at least one second blind hole are selectively formed on at least one of the first lead frame and the second lead frame, the first blind hole is formed concavely on an upper surface of the metallic frame and located substantially adjacent to a circumference of the light-permitting portion, and the second blind hole is formed in proximate to the electrically insulated region;

wherein the at least one first blind hole is distributed around the chip-mounting area that the at least one LED chip is mounted thereon, and the at least one second blind hole is communicated with the electrically insulated region.

17. The LED device of claim 16 , wherein the base portion encapsulates the first and second lead frames, and has a receiving space formed above the first and second lead frames for receiving the LED chip therein and an annular light-reflecting surface surrounded the receiving space for reflecting light emitted by the LED chip.

18. The LED device of claim 17 , wherein the base portion further includes a rib made of a light-reflecting material penetrating the electrically insulated region and protruding from the upper surface of the metallic frame.

19. The LED device of claim 18 , wherein the base portion and the light-permitting portion are formed in one piece, and the packaging body directly encapsulates the first and second lead frames.

20. The LED device of claim 16 , wherein the first and second lead frames are encapsulated by a non-light transmitting base portion of the packaging body, and the non-light transmitting base portion is flush with an upper and a lower surfaces of the metallic frame.