SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND TERMINAL STRUCTURE OF STANDARD CELL
A semiconductor integrated circuit device includes a first standard cell and a second standard cell adjacent to the first standard cell in a first direction. An interconnect is provided to extend in the first direction to electrically connect input and output terminal portions, which extend in a second direction orthogonal to the first direction. The output terminal portion extends in a first sub-direction of the second direction from a region connected to the interconnect, but not in a second sub-direction opposite to the first sub-direction. The input terminal portion extends in a second sub-direction of the second direction from a region connected to the interconnect, but not in the first sub-direction.
1 . A semiconductor integrated circuit device comprising:
a first standard cell;
a second standard cell adjacent to the first standard cell in a first direction;
an output terminal portion provided as an output terminal of the first standard cell to extend in a second direction orthogonal to the first direction;
an input terminal portion provided as an input terminal of the second standard cell to extend in the second direction; and
an interconnect provided to extend in the first direction to electrically connect the output terminal portion to the input terminal portion, wherein
the output terminal portion, the input terminal portion, and the interconnect are formed in a same metal interconnect layer,
the output terminal portion extends in a first sub-direction of the second direction from a region connected to the interconnect, but not in a second sub-direction opposite to the first sub-direction, and
the input terminal portion extends in the second sub-direction of the second direction from a region connected to the interconnect, but not in the first sub-direction.
2 . The device of claim 1 , wherein
at least one of the output terminal portion or the input terminal portion includes a protrusion formed to protrude in a sub-direction of the first direction opposite to the interconnect.
3 . The device of claim 1 , wherein
the output terminal portion is an output terminal of the first standard cell, which is closest to the second standard cell, and
the input terminal portion is an input terminal of the second standard cell, which is closest to the first standard cell.
4 . The device of claim 1 , wherein
an interconnect width of the interconnect is greater than or equal to terminal widths of the output terminal portion and the input terminal portion.
5 . A terminal structure of a standard cell, the structure comprising:
an input terminal portion provided as an input terminal of the standard cell to extend in a first direction; and
an output terminal portion provided as an output terminal of the standard cell to extend in the first direction, wherein
the input terminal portion overlaps the output terminal portion in an overlapping region as viewed along a second direction orthogonal to the first direction,
the input terminal portion extends in a first sub-direction of the first direction from the overlapping region, but not in a second sub-direction opposite to the first sub-direction, and
the output terminal portion extends in the second sub-direction of the first direction from the overlapping region, but not in the first sub-direction.
6 . The terminal structure of claim 5 , wherein
at least one of the input terminal portion or the output terminal portion includes a protrusion formed to protrude toward a center of the standard cell in the second direction.
7 . The terminal structure of claim 5 , wherein
the input terminal portion is an input terminal of the standard cell, which is closest to one side of a frame in the second direction, and
the output terminal portion is an output terminal of the standard cell, which is closest to the other side of the frame in the second direction.
8 . A semiconductor integrated circuit device comprising:
a standard cell;
an output terminal portion provided as an output terminal of the standard cell to extend in a first direction;
an input terminal portion provided as an input terminal of the standard cell to extend in the first direction;
a first interconnect connected to the output terminal portion, and provided to extend in a first sub-direction of a second direction orthogonal to the first direction from the output terminal portion; and
a second interconnect connected to the output terminal portion, and provided to extend in a second sub-direction of the second direction, which is opposite to the first sub-direction, from the output terminal portion, wherein
the output terminal portion, the input terminal portion, and the first and second interconnects are formed in a same metal interconnect layer,
the first interconnect does not overlap the second interconnect as viewed along the second direction, and
a terminal width of the output terminal portion between a portion connected to the first interconnect and a portion connected to the second interconnect is greater than a terminal width of the input terminal portion.
9 . A semiconductor integrated circuit device comprising:
a first standard cell;
a second standard cell adjacent to the first standard cell in a first direction;
an output terminal portion provided as an output terminal of the first standard cell to extend in a second direction orthogonal to the first direction;
an input terminal portion provided as an input terminal of the second standard cell to extend in the second direction; and
an interconnect provided to extend in the first direction to electrically connect the output terminal portion to the input terminal portion, wherein
the output terminal portion, the input terminal portion, and the interconnect are formed in a same metal interconnect layer,
the output terminal portion is located in a same position and has a same length as the input terminal portion in the second direction, and
the interconnect has an interconnect width which is equal to lengths of the output terminal portion and the input terminal portion, and is located in a same position as the output terminal portion and the input terminal portion in the second direction.
10 . The device of claim 9 , wherein
at least one of the output terminal portion or the input terminal portion includes a protrusion formed to protrude in a sub-direction of the first direction opposite to the interconnect.