Polymer nanocomposites for electronic applications
Disclosed herein are nanocomposite materials, devices thereof and methods thereof with a dielectric constant and corona resistance while having an increased or substantially maintained energy density, breakdown strength and/or dissipation factor relative to the polymer.
1. A dielectric nanocomposite, comprising
a continuous polymer phase comprising a polymeric material that exhibits a base corona resistance, a base dielectric constant (DK) value K 1 , a base energy density, and a base dielectric breakdown strength; and
a dispersed particulate phase comprising a nano particulate inorganic filler material that exhibits a DK value K 2 , wherein the value of K 2 is greater than K 1 and wherein the nano particulate inorganic filler material is dispersed within the continuous polymer phase;
wherein the nanocomposite exhibits a corona resistance that is greater than the base corona resistance of the polymeric material;
wherein the nanocomposite exhibits an energy density that is not less than 65% of the base energy density of the polymeric material; and
wherein the nanocomposite exhibits a dielectric breakdown strength that is not less than 80% of the base dielectric breakdown strength of the polymeric material.
2. The dielectric nanocomposite of claim 1 ,wherein the DK value K 2 is at least 30 times greater than the DK value K 1 .
3. The dielectric nanocomposite of claim 1 , wherein the DK value K 2 is at least 2 times greater than the DK value K 1 .
4. The dielectric nanocomposite of claim 1 , wherein the DK of the nanocomposite is at least 25% greater than the DK value K 1 .
5. The dielectric nanocomposite of claim 1 , wherein the DK of the nanocomposite is at least 60% greater than the DK value K 1 .
6. The dielectric nanocomposite of claim 1 , wherein the corona resistance of the nanocomposite is at least 6 times greater than the base corona resistance of the polymeric material.
7. The dielectric nanocomposite of claim 1 , wherein the corona resistance of the nanocomposite is at least 12 times greater than the base corona resistance of the polymeric material.
8. The dielectric nanocomposite of claim 1 , wherein the corona resistance of the nanocomposite is at least 50 times greater than the base corona resistance of the polymeric material.
9. The dielectric nanocomposite of claim 1 , wherein the energy density of the nanocomposite is not less than 75% of the base energy density value of the polymeric material.
10. The dielectric nanocomposite of claim 1 , wherein the dielectric breakdown strength of the nanocomposite is not less than 85% of the base dielectric breakdown strength of the polymeric material.
11. The dielectric nanocomposite of claim 1 , wherein the dissipation factor (DF) of the nanocomposite is less than 1%.
12. The dielectric nanocomposite of claim 1 , wherein the loading of nano particulate inorganic filler material in the nanocomposite is less than 5% by volume.
13. The dielectric nanocomposite of claim 1 , wherein the loading of nano particulate inorganic filler material in the nanocomposite is at least 5% by volume.
14. The dielectric nanocomposite of claim 1 , wherein the nano particulate inorganic filler material comprises Al 2 O 3 , ZrO 2 , TiO 2 , SrTiO 3 , BaTiO 3 , or fumed silica; or a combination thereof.
15. The dielectric nanocomposite of claim 14 , wherein the nano particulate inorganic filler material has a size less than 900 nm.
16. The dielectric nanocomposite of claim 14 , wherein the nano particulate inorganic filler material has a size between 10-200 nm.
17. The dielectric nanocomposite of claim 1 , wherein the polymeric material comprises a polyetherimide, polyester, polystyrene, polyether, polyamide, polyurethane, polyethylene, polypropylene, polyethylene oxide or polyethylene glycol (PEG), polylactide, such as polylactic acid (PLA) and poly(lactic-co-glycolic acid) PLGA, polyimide, polyvinylidene fluoride (PVDF), polymethylmethacrylate (PMMA), polycarbonate, esterpolycarbonate, polysulfone, cyanated polycarbonate, cyanated polyetherimide, cyanated polysulfone, polyphenylene oxide, or polyvinyl chloride or co-polymers or mixtures thereof.
18. The dielectric nanocomposite of claim 1 , wherein the polymeric material comprises
wherein n is greater than 10.
19. The dielectric nanocomposite of claim 1 , further comprising an interface modifier.
20. A thin film comprising the nanocomposite material of claim 1 .
21. A foam comprising the nanocomposite material of claim 1 .
22. A fiber comprising the nanocomposite material of claim 1 .
23. An article of manufacturer comprising a nanocomposite material of claim 1 .
24. The article of manufacturer of claim 21 , wherein the article is a membrane, separator, capacitor or supercapacitor.
25. A method of making a dielectric nanocomposite comprising:
providing a polymeric material that exhibits a base corona resistance, a base dielectric constant (DK) value K 1 , a base energy density, and a base dielectric breakdown strength;
providing a nano particulate inorganic filler material that exhibits a DK value K 2 , wherein the value of K 2 is greater than K 1 ; and
blending the polymeric material and the nano particulate inorganic filler under conditions effective to form a nanocomposite having a continuous phase comprising the polymeric material and a dispersed phase comprising the nano particulate inorganic filler;
wherein the formed nanocomposite exhibits a corona resistance that is greater than the base corona resistance of the polymeric material;
wherein the formed nanocomposite exhibits an energy density that is not less than 65% of the base energy density of the polymeric material; and
wherein the nanocomposite exhibits a dielectric breakdown strength that is not less than 80% of the base dielectric breakdown strength of the polymeric material.
26. The method of claim 24 , wherein the DK value K 2 is at least 30 times greater than the DK value K 1 .
27. The method of claim 24 , wherein the DK value K 2 is at least 2 times greater than the DK value K 1 .
28. The method of claim 24 , wherein the DK of the nanocomposite is at least 25% greater than the DK value K 1 .
29. The method of claim 24 , wherein the DK of the nanocomposite is at least 60% greater than the DK value K 1 .
30. The method of claim 24 , wherein the corona resistance of the nanocomposite is at least 6 times greater than the base corona resistance of the polymeric material.
31. The method of claim 24 , wherein the corona resistance of the nanocomposite is at least 12 times greater than the base corona resistance of the polymeric material.
32. The method of claim 24 , wherein the corona resistance of the nanocomposite is at least 50 times greater than the base corona resistance of the polymeric material.
33. The method of claim 24 , wherein the energy density of the nanocomposite is not less than 75% of the base energy density value of the polymeric material.
34. The method of claim 24 , wherein the dielectric breakdown strength of the nanocomposite is not less than 85% of the base dielectric breakdown strength of the polymeric material.
35. The method of claim 24 , wherein the formed nanocomposite exhibits a dissipation factor (DF) less than 1%.
36. The method of claim 24 , wherein an amount of the nano particulate inorganic filler material is provided such that the nano particulate inorganic filler material is present in the nanocomposite in a loading amount that is at less than 5% by volume.
37. The method of claim 24 , wherein an amount of the nano particulate inorganic filler material is provided such that the nano particulate inorganic filler material is present in the nanocomposite in a loading amount that is at least 5% by volume.
38. The method of claim 23 , wherein the nano particulate inorganic filler material comprises Al 2 O 3 , ZrO 2 , TiO 2 , SrTiO 3 , BaTiO 3 , or fumed silica; or a combination thereof.
39. The method of claim 38 , wherein the nano particulate inorganic filler material has a particle size less than 900 nm.
40. The method of claim 38 , wherein the nano particulate inorganic filler material has a particle size between 10-200 nm.
41. The method of claim 24 , wherein the polymeric material comprises a polyetherimide, polyester, polystyrene, polyether, polyarnide, polyurethane, polyethylene, polypropylene, polyethylene oxide or polyethylene glycol (PEG), polylactide, such as polylactic acid (PLA) and poly(lactic-co-glycolic acid) PLGA, polyimide, polyvinylidene fluoride (PVDF), polymethylmethacrylate (PMMA), polycarbonate, esterpolycarbonate, polysulfone, cyanated polycarbonate, cyanated polyetherimide, cyanated polysulfone, polyphenylene oxide, or polyvinyl chloride, or co-polymers or mixtures thereof.
42. The method of claim 24 , wherein the blending conditions effective to form the nanocomposite comprise:
forming a solvent system by (i) dispersing the provided nano particulate inorganic filler material in a solvent; and (ii) dissolving the polymeric material in the solvent; and
casting the nanocomposite material from the formed solvent system.
43. The method of claim 24 , wherein the blending conditions effective to form the nanocomposite comprise: feeding a polymer and a particulate filler to a mixer, such as an extruder of the single- or twin-screw type, melting the polymer by the action of the screw, dispersing the filler into the polymer to form a homogeneous dispersion, and pumping the composite material out of the extruder to form the melt into strands or films.