Method and apparatus for multi-chip structure semiconductor package
A packaged semiconductor device may include a leadframe and a die carrier mounted to the leadframe. The die carrier is formed from an electrically and thermally conductive material. A die is mounted to a surface of the die carrier with die attach material having a melting point in excess of 240° C. A first electrical interconnect couples the die and the leadframe. A housing covers portions of the leadframe, die carrier, die and first electrical interconnect.
1. A device, comprising:
a package comprising:
a die carrier comprising an electrically and thermally conductive material, wherein the die carrier has a thermal conductivity of at least 150 watts per meter Kelvin (W/in-K) and the die carrier has a thickness of at least 10 mils and less than 30 mils;
a die; and
die attach material attaching the die to the die carrier, and the die attach material has a melting point in excess of 240° C.
2. A device according to claim 1 , wherein the die attach material comprises an element that is not present in the die carrier.
3. A device according to claim 2 , wherein the element that is not present in the die carrier is gold.
4. A device according to claim 2 , wherein the element that is not present in the die carrier is silver.
5. A device according to claim 1 , wherein the die attach material comprises gold.
6. A device according to claim 1 , wherein the die carrier has a camber of no more than 5 mils.
7. A packaged semiconductor device (SD), comprising:
a leadframe;
a die carrier mounted to the leadframe, the die carrier comprising an electrically and thermally conductive material, the die carrier having a thermal conductivity of at least 150 watts per meter Kelvin (W/m-K) and having a thickness of at least 10 mils and less than 30 mils;
a die mounted to a surface of the die carrier with die attach material having a melting point in excess of 240° C.;
a first electrical interconnect coupled to the die and the leadframe; and
a solid body comprising overmold encapsulant on at least portions of the leadframe, die carrier, die and first electrical interconnect.
8. A packaged device according to claim 7 , wherein the leadframe has leads, and the die is one of a plurality of die mounted to the surface of the die carrier.
9. A packaged device according to claim 7 , further comprising a plurality of electrical interconnects including the first electrical interconnect and a second electrical interconnect, and the second electrical interconnect shunts the die to itself.
10. A packaged device according to claim 9 , wherein the first electrical interconnect comprises a first loop height, and the second electrical interconnect comprises a second loop height, and the second loop height differs from the first loop height by at least 15 mils.
11. A packaged device according to claim 9 , wherein the first electrical interconnect is a series wire, and the second electrical interconnect is a shunt wire.
12. A packaged device according to claim 11 , wherein portions of the shunt and series wires define an angle therebetween as viewed along a plane of the surface of the die carrier, and the angle is at least 80 degrees with respect to said portions.
13. A packaged device according to claim 7 , wherein the die and die carrier comprise a combined thickness that is substantially equal to a thickness of the leadframe.
14. A packaged device according to claim 7 , wherein the die attach material comprises at least one of Au, and Ag.
15. A method, comprising:
attaching a die to a die carrier using a die attach material, the die attach material having a melting point in excess of 240° C.; and
packaging the die, the die carrier, and the die attach material, the die carrier comprising an electrically and thermally conductive material, the die carrier having a thermal conductivity of at least 150 watts per meter Kelvin (W/m-K), and the die carrier having a thickness of at least 10 mils and less than 30 mils.
16. A method according to claim 15 , wherein the die attach material comprises an element that is not present in the die carrier.
17. A method according to claim 16 , wherein the element that is not present in the die carrier is gold.
18. A device according to claim 16 , wherein the element that is not present in the die carrier is silver.
19. A device according to claim 15 , wherein the die attach material comprises gold.
20. A device according to claim 15 , wherein the die carrier has a camber of no more than 5 mils.