Method and system for manufacturing an electronic interface apparatus
View Patent ↗A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.
1. A method for manufacture of an electronic interface card, said method comprising:
forming a substrate having at least one layer;
forming an antenna in said at least one layer;
connecting wires between a chip module and said antenna by:
attaching continuous connection wires to a plurality of chip modules;
attaching said continuous connection wires to a plurality of said antennas;
cutting said continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding antenna; and
mounting said chip module on said substrate.
2. The method for manufacture of an electronic interface card according to claim 1 , wherein adjacent ones of said chip modules are spaced along said connection wires by a predetermined spacing and said antennas adjacent ones of said substrates are mutually spaced by said predetermined spacing, prior to said attaching said continuous connection wires to said plurality of antennas.
3. The method for manufacture of an electronic interface card according to claim 1 , wherein said wires have a length greater than the distance between their respective opposite ends in said electronic interface card.
4. The method according to claim 1 , wherein said mounting comprising folding said wires underneath said chip module.
5. The method according to claim 1 , wherein said method is automated.
6. The method for manufacture of an electronic interface card according to claim 1 , in which
forming a substrate having at least one layer is accomplished by providing a substrate having at least one substrate layer;
forming an antenna in said at least one layer is accomplished by associating an antenna with said at least one substrate layer, and connecting said antenna to conductors associated with said at least one substrate layer; and
mounting said chip module on said substrate includes sealing at least one of said chip modules to said substrate.
7. The method for manufacture of an electronic interface card according to claim 6 , including:
defining a pair of apertures in a substrate layer such that opposite ends of said antenna terminate at said apertures; and
placing said conductors in each of said apertures prior to said connecting.
8. The method for manufacture of an electronic interface card according to claim 7 , including laminating said substrate layer together with a top layer and a bottom layer.
9. The method for manufacture of an electronic interface card according to claim 6 , including laminating said substrate layer together with a top layer and a bottom layer.