Cell attachment method
A method of manufacturing an electrical device comprises the steps of providing a substrate, providing an electrical component on the substrate, providing a first electrical contact on the substrate that is electrically connected to the electrical component, and providing an electrochemical cell on or integrating the substrate for providing electrical energy to said electrical component. The electrochemical cell comprises at least one electrochemical layer comprising a cured or dried ink and a first electrode contact electrically connected to said at least one electrochemical layer. The method further includes the step of securing the electrochemical cell to the substrate through an electrically conductive connection that provides both a structural connection and an electrical connection between the first electrical contact and the first electrode contact.
1. A method of manufacturing an electrical device, comprising the steps of:
providing a substrate;
providing an electrical component on the substrate;
providing a first electrical contact on the substrate that is electrically connected to the electrical component;
providing an electrochemical cell on or integrating the substrate for providing electrical energy to said electrical component, said electrochemical cell comprising at least one electrochemical layer comprising a cured or dried ink and a first electrode contact electrically connected to said at least one electrochemical layer;
securing the electrochemical cell to the substrate through an electrically conductive connection that provides both a structural connection and an electrical connection between the first electrical contact and the first electrode contact,
providing a second electrical contact on the substrate that is electrically connected to the electrical component;
providing the electrochemical cell with a second electrochemical layer and a second electrode contact electrically connected to said second electrochemical layer; and
securing the electrochemical cell to the substrate through an electrically conductive connection that provides both a structural connection and an electrical connection between the second electrical contact and the second electrode contact.
2. The method of claim 1 , further comprising the step of securing the electrochemical cell to the substrate through an intermediate non-conductive adhesive located between the electrochemical cell and the substrate.
3. The method of claim 1 , wherein the cured or dried ink includes zinc.
4. The method of claim 1 , wherein said electrochemical cell comprises at least one electrochemical layer including zinc foil.
5. A method of manufacturing an electrical device, comprising the steps of:
providing a substrate;
providing an electrical component on the substrate;
providing a first electrical contact on the substrate that is electrically connected to the electrical component;
providing an electrochemical cell on or integrating the substrate for providing electrical energy to said electrical component, said electrochemical cell comprising at least one electrochemical layer comprising a cured or dried ink and a first electrode contact electrically connected to said at least one electrochemical layer;
securing the electrochemical cell to the substrate through an electrically conductive connection that provides both a structural connection and an electrical connection between the first electrical contact and the first electrode contact,
arranging the first electrode contact over the first electrical contact; and
perforating the first electrode contact such that at least a portion of the first electrode contact is forced into contact with the first electrical contact to be electrically connected to the first electrical contact.
6. The method of claim 5 , wherein the step of securing the electrochemical cell to the substrate further comprises securing the first electrical contact to the first electrode contact by a conductive adhesive.
7. The method of claim 6 , further comprising the step of placing the conductive adhesive between the first electrical contact and the first electrode contact.
8. The method of claim 6 , further comprising the step of placing the conductive adhesive onto both of an upper exposed surface of the first electrical contact and an upper exposed surface of the first electrode contact.
9. The method of claim 5 , wherein the step of perforating the first electrode contact is performed using a plurality of penetration members driven substantially simultaneously by a force head.
10. The method of claim 9 , wherein at least one of the penetration members is electrically non-conductive.
11. The method of claim 9 , wherein at least two of the penetration members are electrically conductive and are coupled by a non-conductive holding member to inhibit electrical connection between said at least two of the penetration members.
12. The method of claim 11 , further comprising the step of limiting a penetration depth of the penetration members relative to the electrochemical cell by fixing a length of the penetration members that extend from the non-conductive holding member.
13. The method of claim 5 , wherein at least a portion of the first electrode contact is forced through the first electrical contact and punctures the substrate.
14. The method of claim 5 , further comprising the step of providing a non-conductive spacer layer between the first electrode contact and the first electrical contact.
15. The method of claim 5 , further comprising the step of heat sealing the first electrode contact to the first electrical contact.
16. The method of claim 5 , further comprising the step of pressure sealing the first electrode contact to the first electrical contact.
17. The method of claim 5 , further comprising the step of pressure sealing and heat sealing the first electrode contact to the first electrical contact.
18. A method of manufacturing an electrical device, comprising the steps of:
providing a substrate;
providing an electrical component on the substrate;
providing a first electrical contact on the substrate that is electrically connected to the electrical component;
providing an electrochemical cell on or integrating the substrate for providing electrical energy to said electrical component, said electrochemical cell comprising at least one electrochemical layer comprising a cured or dried ink and a first electrode contact electrically connected to said at least one electrochemical layer;
arranging the first electrode contact over the first electrical contact; and
perforating the first electrode contact such that at least a portion of the first electrode contact is both structurally connected and electrically connected to the first electrical contact.
19. The method of claim 18 , further comprising the steps of:
providing a non-conductive spacer layer between the first electrode contact and the first electrical contact; and
perforating the first electrode contact such that at least a portion of the first electrode contact is forced through the non-conductive spacer layer to be electrically connected to the first electrical contact.
20. The method of claim 18 , wherein the step of perforating the first electrode contact is performed using a plurality of penetration members driven substantially simultaneously by a force head.
21. The method of claim 20 , wherein at least one of the penetration members is electrically non-conductive.
22. The method of claim 20 , wherein at least two of the penetration members are electrically conductive and are coupled by a non-conductive holding member to inhibit electrical connection between said at least two of the penetration members.
23. The method of claim 20 , further comprising the step of limiting a penetration depth of the penetration members relative to the electrochemical cell by fixing a length of the penetration members that extend from a non-conductive holding member.