Processes for multi-layer devices utilizing layer transfer
View Patent ↗A method includes forming a release layer over a donor substrate. A plurality of devices made of a first semiconductor material are formed over the release layer. A first dielectric layer is formed over the plurality of devices such that all exposed surfaces of the plurality of devices are covered by the first dielectric layer. The plurality of devices are chemically attached to a receiving device made of a second semiconductor material different than the first semiconductor material, the receiving device having a receiving substrate attached to a surface of the receiving device opposite the plurality of devices. The release layer is etched to release the donor substrate from the plurality of devices. A second dielectric layer is applied over the plurality of devices and the receiving device to mechanically attach the plurality of devices to the receiving device.
1. A method comprising:
forming a release layer over a donor substrate;
forming a plurality of devices made of a first semiconductor material over the release layer;
applying a first dielectric layer over the plurality of devices such that all exposed surfaces of the plurality of devices are covered by the first dielectric layer;
attaching the plurality of devices to it receiving structure made of a second semiconductor material, the receiving structure having a receiving substrate attached to a surface of the receiving structure opposite the plurality of devices, wherein the plurality of devices are a
first plurality of devices and the receiving structure a first receiving structure; etching the release layer to release the donor substrate from the plurality of devices; and attaching a second, plurality of devices to a second receiving structure positioned along a surface of the receiving substrate opposite the first receiving structure.
2. The method of claim 1 wherein the first semiconductor material is a group IV semiconductor material.
3. The method of claim 1 wherein the first semiconductor material is different from the second semiconductor material and the first semiconductor material is a group III-V semiconductor material.
4. The method of claim 1 wherein attaching comprises chemically bonding the plurality of devices to the receiving devices at room temperature.
5. The method of claim 1 wherein the release layer is made of a material that can be etched using, an etchant that does not substantially remove the first dielectric layer.
6. The method of claim 1 wherein the release layer is made of AlInP and the etchant is HCl or the release layer is made of silicon and the etchant is XeF 2 .
7. The method of claim 1 wherein the plurality of devices are a first plurality of devices and the method further comprises:
attaching a second plurality of devices to respective ones of the first plurality of devices.
8. The method of claim 1 further comprising:
applying a second dielectric layer over the plurality of devices and the receiving structure to mechanically attach the plurality of devices to the receiving structure; and
depositing metal contacts on the plural it of devices.
9. The method of claim 1 further comprising:
attaching a handle substrate, to the plurality of devices; and
removing the plurality of devices and the receiving structure from the receiving substrate.
10. The method of claim 1 wherein one of the donor substrate and the receiving substrate is a structured wafer having holes extending vertically through a thickness of the structured wafer.
11. The method of claim 1 wherein one of the first dielectric layer and the second dielectric layer is from 0.01 μm to 1 μm.
12. A method comprising:
forming a donor device comprising a plurality of devices attached to a donor substrate, the plurality of devices made of a compound semiconductor material and positioned between a release layer formed over the donor substrate and a first dielectric layer formed over the plurality of devices;
attaching the plurality of devices to a receiving device at room temperature, the receiving structure having a plurality of receiving devices made of a different material than the plurality devices and attached to a receiving substrate at a side opposite the plurality devices;
etching the release layer to release the plurality of devices from the donor substrate, wherein the etchant selectively removes the release layer without substantially removing the first dielectric layer;
applying a second dielectric layer over the plurality of devices and the receiving structure to cover any exposed surfaces of the plurality of devices and mechanically attach the plurality of devices to the receiving devices;
attaching a handle substrate to the plurality devices; and
removing the plurality of devices and the receiving structure from the receiving substrate.
13. The method of claim 12 wherein the first semiconductor material is a group semiconductor material.
14. The method of claim 12 wherein attaching comprises bonding the plurality of devices to the receiving structure at room temperature.
15. The method of claim 12 wherein the release layer is made of A Ile and the etchant is HCl or the release layer is made of silicon and the etchant is XeF 2 .
16. The method of claim 12 wherein the plurality of devices are a first plurality of devices and the method further comprises:
after applying the second dielectric layer, attaching a second plurality of devices to respective ones of the first plurality or devices.
17. The method of claim 12 further comprising:
adding functionality to the plurality of devices, the functionality being different than a functionality of the receiving devices.