Semiconductor device

1. A semiconductor device comprising:

a first conductivity type first MIS transistor formed on a first active region of a semiconductor substrate;

a second conductivity type second MIS transistor formed on a second active region of the semiconductor substrate, the second conductivity type differs from the first conductivity type; and

a first dummy element formed on a first dummy active region of the semiconductor substrate, wherein

the first MIS transistor includes:

a first gate insulating film which includes a first high dielectric constant insulating film formed on the first active region and contains an adjusting metal, and

a first gate electrode formed on the first gate insulating film,

the second MIS transistor includes:

a second gate insulating film which includes a second high dielectric constant insulating film formed on the second active region and is free of the adjusting metal, and

a second gate electrode formed on the second gate insulating film,

the first dummy element includes:

a first dummy gate insulating film which includes a first dummy high dielectric constant insulating film formed on the first dummy active region and at least a portion of which is free of the adjusting metal, the first dummy gate insulating film does not include an element isolation region, and

a first dummy gate electrode formed on the first dummy gate insulating film,

the first active region, the second active region, and the first dummy active region are surrounded by the element isolation region formed in the semiconductor substrate,

the first active region is formed in a second conductivity type first well region,

the second active region is formed in a first conductivity type second well region, and

the first dummy active region is formed in a second conductivity type third well region.

2. The semiconductor device of claim 1 , wherein an entire portion of the first dummy gate insulating film is free of the adjusting metal.

3. The semiconductor device of claim 2 , further comprising:

a second dummy element formed on a second dummy active region of the semiconductor substrate, wherein

the second dummy element includes:

a second dummy gate insulating film which includes a second dummy high dielectric constant insulating film formed on the second dummy active region, and

a second dummy gate electrode formed on the second dummy gate insulating film, and

the second dummy gate insulating film includes an adjusting-metal-containing portion which contains the adjusting metal and an adjusting-metal-free portion which is free of the adjusting metal.

4. The semiconductor device of claim 1 , wherein the first dummy gate insulating film includes an adjusting-metal-containing portion which contains the adjusting metal and an adjusting-metal-free portion which is free of the adjusting metal.

5. The semiconductor device of claim 1 , wherein the first dummy gate insulating film and the first dummy gate electrode are formed to extend on both the element isolation region and the first dummy active region.

6. The semiconductor device of claim 1 , wherein the first dummy active region has a width of 0.2-10 μm in a gate length direction.

7. The semiconductor device of claim 1 , wherein the first dummy active region has a width of 0.4-10 μm in a gate width direction.

8. The semiconductor device of claim 1 , further comprising:

a second dummy active region of the semiconductor substrate adjacent to the first dummy active region in a gate length direction, wherein

an interval between the first dummy active region and the second dummy active region is 0.2-5 μm.

9. The semiconductor device of claim 1 , further comprising:

a second dummy active region of the semiconductor substrate adjacent to the first dummy active region in a gate width direction, wherein

an interval between the first dummy active region and the second dummy active region is 0.4-10 μm.

10. The semiconductor device of claim 1 , wherein the first dummy gate insulating film includes a first dummy underlying film formed between the first dummy active region and the first dummy high dielectric constant insulating film.

11. The semiconductor device of claim 1 , wherein the first dummy high dielectric constant insulating film is made of metal oxide having a relative dielectric constant of 10 or higher.

12. The semiconductor device of claim 1 , wherein the first dummy gate electrode includes a first dummy metal film formed on the first dummy gate insulating film and a first dummy silicon film formed on the first dummy metal film.

13. The semiconductor device of claim 1 , wherein:

the first MIS transistor is an n-type MIS transistor,

the second MIS transistor is a p-type MIS transistor, and

the adjusting metal is lanthanum.

14. The semiconductor device of claim 1 , wherein:

the first MIS transistor is a p-type MIS transistor,

the second MIS transistor is an n-type MIS transistor, and

the adjusting metal is aluminum.

15. The semiconductor device of claim 1 , further comprising:

a second dummy element formed on a second dummy active region of the semiconductor substrate, wherein:

the second dummy element includes:

a second dummy gate insulating film which includes a second dummy high dielectric constant insulating film formed on the second dummy active region, and

a second dummy gate electrode formed on the second dummy gate insulating film, and

an entire portion of the second dummy high dielectric constant insulating film contains the adjusting metal.