IP Library Granted Patent US 9,052,699
Granted Patent B2
US 9,052,699 · App. 13/630,103 · Granted Jun 9, 2015

Method of manufacturing piezoelectric vibration reed, piezoelectric vibration reed, piezoelectric vibrator, oscillator, electronic instrument, and radio time piece

Inventor: Daishi Arimatsu (Chiba, JP)
Assignee: SII CRYSTAL TECHNOLOGY INC.
G04R20/00G04R20/10H03H3/04H03H9/1021H03H9/21H03H2003/0492
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Quick Facts
Patent No.
US 9,052,699
App. No.
13/630,103
Granted
Jun 9, 2015
Kind
B2
Abstract

A method of manufacturing a piezoelectric vibration reed is provided. The piezoelectric vibration reed includes a pair of vibrating arm portions and a base portion. The pair of vibrating arm portions is disposed in parallel to each other. The base portion is configured to integrally support proximal end portions of the pair of vibrating arm portions in a longitudinal direction of the vibrating arm portions. The method of manufacturing the piezoelectric vibration reed forms a slit-shaped notched portion at a crotch portion located between the proximal end portions of the pair of vibrating arm portions.

Claims (8)

1. A method of manufacturing a piezoelectric vibration reed comprising a pair of vibrating arm portions in parallel to each other with a crotch portion located between proximal end portions of the pair of vibrating arm portions and a base portion configured to integrally support the proximal end portions of the pair of vibrating arm portions in a longitudinal direction of the vibrating arm portions, the method comprising:

forming a contour of the piezoelectric vibration reed from a piezoelectric wafer, comprising:

forming a photolithographic mask pattern by forming an etching protection film on both main surfaces of the piezoelectric wafer, the mask pattern corresponding to a contour of the piezoelectric vibration reed, the mask pattern including a slit-shaped notched portion extending through the base portion along the longitudinal direction, the notched portion formed at the crotch portion, and

wet etching both main surfaces using the mask pattern as an etching mask and forming the slit-shaped notched portion, the slit-shaped notched portion having a constant width along the longitudinal direction.

2. The method of claim 1 , wherein the wet etching is performed on the piezoelectric wafer along the shape of the mask pattern, so that the contour of the piezoelectric vibration reed is formed.

3. The method of claim 1 , wherein wet etching both main surfaces comprises flowing an etching solution in the longitudinal direction of the pair of vibrating arm portions along the slit-shaped notched portion, thereby reducing etching residuals on the crotch portion.

4. The method of claim 1 , further comprising determining a width and a length of the slit-shaped notched portion based on a curvature R of the crotch portion.

5. The method of claim 1 , wherein a width of the slit-shaped notched portion is on the order of ⅓ of the distance between the pair of vibrating arm portions.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2013
From: SEIKO INSTRUMENTS INC.
To: SII CRYSTAL TECHNOLOGY INC.
Reel/Frame 031085/0852 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2012
From: ARIMATSU, DAISHI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 029048/0752 →
Priority Claims (1)
JP 2011-218238 · Sep 30, 2011 · national
Continuity (1)
Related Publication 20130082576A1 · Apr 4, 2013