Devices and methods for automatically cleaving and abrading cables

1. A device comprising:

a cleaver configured to automatically cleave a bare fiber extending from an end face of a terminus or connector of a fiber optic cable, the cleaver including a stress applicator configured to stress the bare fiber and a defect-formation device configured to create a surface defect at a surface of the bare fiber under stress when the bare fiber is stressed by the stress applicator;

an abrader configured to automatically abrade the end face of the terminus or connector after the bare fiber is cleaved;

a chuck configured to receive the terminus or connector; and

an index carriage configured to selectably move between a first position in which the cleaver is aligned with the chuck and a second position in which the abrader is aligned with the chuck.

2. The device of claim 1 , wherein the defect-formation device is a blade.

3. The device of claim 1 , wherein the stress applicator is a bending element comprises a ramped surface configured to contact the bare fiber.

4. The device of claim 1 , wherein the cleaver is driven by a linear actuator.

5. The device of claim 4 , wherein a single continuous movement of the linear actuator in a single direction causes the stress applicator and the defect-formation device to initially move distally to receive the bar fiber, and subsequently move laterally.

6. The device of claim 5 , wherein the defect-formation device is configured to form the surface defect upon lateral movement of the cleaver.

7. The device of claim 1 , wherein the abrader comprises a plate configured to press an abrasive tape against the end face of the terminus or connector.

8. The device of claim 1 , wherein the abrader comprises an abrasion head.

9. The device of claim 8 , wherein the abrader is configured to move the abrasion head relative the terminus or connector in an orbiting motion.

10. The device of claim 8 , wherein the abrasion head is mounted to an eccentric shaft configured to move the abrasion head relative to the terminus or connector in an orbiting motion.

11. The device of claim 10 , further comprising an eccentric counterweight configured to orbit out of phase with the abrasion head when the abrasion head is moved in the orbiting motion.

12. The device of claim 1 , wherein the device is battery powered.

13. A device comprising:

a cleaver configured to automatically cleave a bare fiber extending from an end face of a terminus or connector of a fiber optic cable, the cleaver including a stress applicator configured to stress the bare fiber and a defect-formation device configured to create a surface defect at a surface of the bare fiber under stress when the bare fiber is stressed by the stress applicator;

an abrader configured to automatically abrade the end face of the terminus or connector after the bare fiber is cleaved; and

a controller configured to control and coordinate automatic operation of the cleaver and the abrader.

14. The device of claim 13 , wherein the controller comprises a printed circuit board.

15. A method comprising:

automatically cleaving a bare fiber extending from an end face of a terminus or connector of a fiber optic cable;

automatically abrading the end face of the terminus or connector after the bare fiber is cleaved, the abrading causing removal of at least one of (a) an end portion of the optical fiber extending from the end face and (b) an epoxy exposed at the end face; and

automatically transitioning between the automatically cleaving and the automatically abrading.

16. The method of claim 15 , wherein the automatically cleaving includes stressing the bare fiber.

17. The method of claim 16 , wherein the stressing the bare fiber includes bending the bare fiber.

18. The method of claim 16 , wherein the automatically cleaving further includes creating a surface defect at a surface of the bare fiber under stress when the bare fiber is in a stressed state.