Optical interconnection to an integrated circuit
A system comprises an interposer positioned between an integrated circuit and a system planar. An electrical/optical transceiver is coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals. The interposer comprises a first set of electrical conductors that is electrically coupled to non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the non-I/O electrical connectors on the integrated circuit to the system planar. The interposer further comprises a second set of electrical conductors that is electrically coupled to input/output (I/O) electrical connectors on the integrated circuit, wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals.
1. A system comprising:
an interposer positioned between an integrated circuit and a system planar;
an electrical/optical transceiver coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals;
a first set of electrical conductors in the interposer, wherein the first set of electrical conductors is electrically coupled to integrated circuit (IC) non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the IC non-I/O electrical connectors on the integrated circuit to the system planar; and
a second set of electrical conductors in the interposer, wherein the second set of electrical conductors is electrically coupled to IC input/output (I/O) electrical connectors on the integrated circuit, and wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals, wherein only the electrical I/O signals that are destined for a remote device that has been designated as a remote high-speed device are converted into the optical I/O signals, and wherein the remote high-speed device is not mounted on the server blade.
2. The system of claim 1 , wherein the optical I/O signals bypass the system planar.
3. The system of claim 1 , further comprising:
a poly-optical wave guide coupled to an output of the electrical/optical transceiver, wherein the optical I/O signals pass through the poly-optical wave guide to an optical receiver.
4. The system of claim 3 , wherein the system is mounted on a server blade in a server chassis, and wherein the optical receiver is mounted on a backplane of the server chassis.
5. The system of claim 4 , wherein the remote high-speed device is mounted on another server blade in the server chassis.
6. The system of claim 4 , wherein the remote high-speed device is part of a cloud computing system.
7. The system of claim 3 , wherein the interposer, the electrical/optical transceiver, the first set of electrical conductors, the second set of electrical conductors, and the poly-optical wave guide are all integrated into a single rigid-flex sheet that is supported by a mount on the system planar, and wherein the interposer is electrically coupled to the integrated circuit by a land grid array (LGA) of electrical connectors.
8. The system of claim 7 , wherein the integrated circuit is a microprocessor.
9. The system of claim 7 , wherein the integrated circuit is a field-programmable gate array (FPGA).
10. The system of claim 1 , further comprising:
an electrical conductor multiplexer within the interposer, wherein the electrical conductor multiplexer segregates the first set of electrical conductors from the second set of electrical conductors in the interposer.
11. A system comprising:
an interposer positioned between an integrated circuit and a system planar;
an electrical/optical transceiver coupled to the interposer, wherein the electrical/optical transceiver converts electrical signals into optical signals;
a first set of electrical conductors in the interposer, wherein the first set of electrical conductors is electrically coupled to integrated circuit (IC) non-Input/Output (I/O) electrical connectors on the integrated circuit, and wherein the first set of electrical conductors passes through the interposer to directly connect the IC non-I/O electrical connectors on the integrated circuit to the system planar;
a second set of electrical conductors in the interposer, wherein the second set of electrical conductors is electrically coupled to IC input/output (I/O) electrical connectors on the integrated circuit, and wherein the second set of electrical conductors traverses through the interposer to the electrical/optical transceiver to convert electrical I/O signals from the integrated circuit into optical I/O signals; and
an electrical conductor multiplexer within the interposer, wherein the electrical conductor multiplexer segregates the first set of electrical conductors from the second set of electrical conductors in the interposer.