Method and device for plasma-treating workpieces
The method and device are used to plasma-treat workpieces. The workpiece is inserted into a chamber of a treatment station that can be at least partially evacuated. The plasma chamber is bounded by a chamber bottom, a chamber cover, and a lateral chamber wall. The method process is optically monitored at least at times. In the optical monitoring, spectral lines of the radiation of the plasma above 500 nanometers are evaluated. Preferably, the evaluation is performed for frequencies above 700 nanometers.
1. A method for plasma treatment of a workpiece, comprising the steps of: placing the workpiece into a plasma chamber; subsequently, under influence of a negative pressure, precipitating a coating onto the workpiece after ignition of a plasma; and at least temporarily optically monitoring a process sequence, including, during the optical monitoring, evaluating wave lengths of radiation of the plasma above 500 nanometers, transmitting at least a portion of emission radiation of the plasma through at least one light wave conductor to an optical monitor, and integrating the transmitted signal pattern determined by optical monitoring over at least a predeterminable period of time, wherein the wavelengths have wavelength range defined by transmission characteristics of the at least one light wave conductor, including integrating all intensities in a spectral range of 700 to 1000 nanometers.
2. The method according to claim 1 , including evaluating wavelengths of radiation of the plasma above 600 nanometers.
3. The method according to claim 1 , including evaluating wavelengths of radiation of the plasma above 700 nanometers.
4. The method according to claim 1 , including evaluating at least two different spectral lines.
5. The method according to claim 1 , including coupling the light wave conductor to at least one photo element whose signal is amplified in a local vicinity to the photo element.
6. The method according to claim 1 , including integrating a modulated current/voltage signal pattern issued by a microwave generator, and corresponding to an energy input into a magnetron, over at least a predeterminable period of time.
7. The method according to claim 6 , including using the integration value as reference in correlation to an integration value of the optical monitoring.