Solid-state imaging apparatus having a micro-lens arranged in correspondence with a plurality of on-chip lenses, method of manufacturing solid-state imaging apparatus, and electronic apparatus

1. A solid-state imaging apparatus comprising:

a plurality of photoelectric conversion units that are two-dimensionally arranged;

a plurality of on-chip lenses that are two-dimensionally arranged in correspondence with respective ones of the plurality of photoelectric conversion units;

a micro-lens that is arranged in correspondence with the plurality of the on-chip lenses; and

a transparent material layer that is pinched between the plurality of on-chip lenses and the micro-lens.

2. The solid-state imaging apparatus according to claim 1 , wherein the transparent material layer includes a first intermediate layer that covers the plurality of on-chip lenses and is flattened on a surface thereof, and a second intermediate layer that is arranged between the first intermediate layer and the micro-lens.

3. The solid-state imaging apparatus according to claim 2 , wherein, when a refractive index of respective ones of the on-chip lenses is n 0 , a refractive index of the first intermediate layer is n 1 , and a refractive index of the second intermediate layer is n 2 , a relation of |n 0 −n 1 |>|n 0 −n 2 | is satisfied.

4. The solid-state imaging apparatus according to claim 2 , wherein a film thickness of the second intermediate layer is larger than a film thickness of the first intermediate layer.

5. The solid-state imaging apparatus according to claim 1 , wherein a focal distance of respective ones of the on-chip lenses is smaller than a size of a respective pixel in which the photoelectric conversion unit is arranged.

6. A method of manufacturing a solid-state imaging apparatus, the method comprising:

forming a transparent material layer that is pinched between a plurality of on-chip lenses arranged in correspondence with a plurality of photoelectric conversion units on an upper side of the plurality of photoelectric conversion units that are two-dimensionally arranged and a micro-lens that is arranged in correspondence with the plurality of the on-chip lenses on a substrate on which the plurality of photoelectric conversion units and the plurality of on-chip lenses are formed or a substrate on which the micro-lens is formed.

7. The method of manufacturing a solid-state imaging apparatus according to claim 6 , wherein the forming of the transparent material layer includes forming a first intermediate layer of which a surface is flattened in a state covering the plurality of on-chip lenses and forming a second intermediate layer that is arranged between the first intermediate layer and the micro-lens.

8. The method of manufacturing a solid-state imaging apparatus according to claim 7 , wherein, when a refractive index of respective ones of the on-chip lenses is n 0 , a refractive index of the first intermediate layer is n 1 , and a refractive index of the second intermediate layer is n 2 , a relation of |n 0 −n 1 |>|n 0 −n 2 | is satisfied.

9. The method of manufacturing a solid-state imaging apparatus according to claim 7 , further comprising:

forming the first intermediate layer and the second intermediate layer in this order on a substrate on which the plurality of photoelectric conversion units and the plurality of on-chip lenses are disposed in the upper portion of respective ones of the photoelectric conversion unit; and

forming the micro-lens on an upper portion of the second intermediate layer.

10. The method of manufacturing a solid-state imaging apparatus according to claim 7 , further comprising:

forming the first intermediate layer on the substrate on which the plurality of on-chip lenses are formed;

forming the second intermediate layer on the substrate on which the micro-lens is formed; and

bonding the two substrates by allowing the first intermediate layer and the second intermediate layer to face each other.

11. The method of manufacturing a solid-state imaging apparatus according to claim 7 , further comprising:

forming the second intermediate layer of which a surface is flattened by covering the micro-lens on the substrate on which the micro lens is formed;

forming the first intermediate layer, which has lens shapes acquired by reversing the on-chip lenses on the surface of the second intermediate layer; and

forming the plurality of on-chip lenses by embedding the lens shapes of the first intermediate layer on the first intermediate layer; and

bonding the substrate on which the plurality of photoelectric conversion units are formed and the substrate on which the plurality of on-chip lenses are formed by allowing the plurality of photoelectric conversion units and the plurality of on-chip lenses to face each other.

12. An electronic apparatus comprising:

a plurality of photoelectric conversion units that are two-dimensionally arranged;

a plurality of on-chip lenses that are two-dimensionally arranged in correspondence with respective ones of the plurality of photoelectric conversion units;

a micro-lens that is arranged in correspondence with the plurality of the on-chip lenses;

a transparent material layer that is pinched between the plurality of on-chip lenses and the micro-lens;

an optical system that guides incident light to the micro-lens; and

a signal processing circuit that processes an output signal output from the plurality of photoelectric conversion units.

13. The solid-state imaging apparatus according to claim 1 , wherein the micro-lens and the plurality of on-chip lenses are disposed in a 1:n ratio, where n >1.

14. The method of manufacturing a solid-state imaging apparatus according to claim 6 , further comprising disposing the micro-lens and the plurality of on-chip lenses in a 1:n ratio, where n >1.

15. The electronic apparatus according to Claim 12 , wherein the micro-lens and the plurality of on-chip lenses are disposed in a 1:n ratio, where n >1.

16. The solid-state imaging apparatus according to claim 1 , wherein the transparent material layer includes a first intermediate layer that covers the plurality of on-chip lenses, and a second intermediate layer that is arranged between the first intermediate layer and the micro-lens, wherein a refractive index of the first intermediate layer and a refractive index of the second intermediate layer are substantially the same.