High frequency resistor
An ultra wideband frequency compensated resistor and related methodologies for frequency compensation are disclosed. In exemplary configuration, a resistive layer is provided over a substrate, and a frequency compensating structure is provided over at least a portion of the resistive layer and separated therefrom by an insulative layer. In certain embodiments, the insulating layer may be an adhesive that may also be effective to secure a protective cover over the resistive material and supporting substrate. In selected embodiments, the frequency compensating structure corresponds to a plurality of conductive layers, one or more of which may be directly electrically connected to terminations for the resistive material while one or more of the conductive layers are not so connected.
1. A frequency compensated surface mount resistor, comprising:
an elongated substrate having upper and lower surfaces, said surfaces bounded by side portions;
a resistive layer formed on said upper surface;
a pair of contact pads formed at opposed longitudinal ends of said substrate; and
a frequency compensating conductive layer formed over said resistive layer.
2. A resistor as in claim 1 , wherein said substrate comprises a glass material.
3. A resistor as in claim 1 , wherein said contact pads comprise one of copper pads and pads comprising wire bondable material.
4. A resistor as in claim 1 , wherein said frequency compensating conductive layer comprises an aluminum layer.
5. A resistor as in claim 1 , wherein said frequency compensating conductive layer is positioned above said resistive layer and configured so as to be out of contact with both of said contact pads.
6. A resistor as in claim 1 , wherein said frequency compensating conductive layer is positioned above said resistive layer and configured so as to contact at least one of said contact pads.
7. A resistor as in claim 1 , wherein said resistive layer comprises tantalum nitrate.
8. A resistor as in claim 1 , wherein said frequency compensating conductive layer comprises one of a generally rectangular layer, a circular layer, and an oval layer.
9. A resistor as in claim 1 , further comprising at least one second frequency compensating conductive layer formed over said resistive layer.
10. A frequency compensated surface mount resistor, comprising:
an elongated substrate having upper and lower surfaces, said surfaces bounded by side portions;
a resistive layer formed on said upper surface;
a pair of contact pads formed at opposed longitudinal ends of said substrate;
a frequency compensating conductive layer formed over said resistive layer; and
at least one second frequency compensating conductive layer formed over said resistive layer;
wherein at least one of said frequency compensating conductive layer and said at least one second frequency compensating conductive layer is coupled to at least one of said contact pads.
11. A resistor as in claim 9 , wherein said frequency compensating conductive layer and said at least one second frequency compensating conductive layer are each coupled respectively to one of said contact pads of said pair of contact pads.
12. A resistor as in claim 9 , wherein said frequency compensating conductive layer and said at least one second frequency compensating conductive layer are generally rectangular.
13. A resistor as in claim 12 , wherein said frequency compensating conductive layer and said at least one second frequency compensating conductive layer have varying longitudinal dimensions.
14. A resistor as in claim 10 , further comprising at least one third frequency compensating conductive layer formed over said resistive layer.
15. A resistor as in claim 14 , wherein at least one of said frequency compensating conductive layer, said at least one second frequency compensating conductive layer, and said at least one third frequency compensating conductive layer is coupled to at least one of said contact pads of said pair of contact pads.
16. A resistor as in claim 14 , wherein at least one of said frequency compensating conductive layer, said at least one second frequency compensating conductive layer, and said at least one third frequency compensating conductive layer is coupled to at least one of said contact pads of sad pair of contact pads.
17. A resistor as in claim 1 , further comprising an adhesive layer positioned between said resistive layer and said frequency compensating conductive layer.
18. A resistor as in claim 1 , further comprising an insulating layer positioned above and encasing said resistive layer and said pair of contact pads, thereby forming a sandwich structure with said substrate, said resistive layer, and said contact pads.
19. A resistor as in claim 18 , wherein said insulating layer comprises a glass layer.
20. A resistor as in claim 18 , further comprising:
termination material applied at opposite ends of said sandwich structure such that said termination material contacts said contact pads,
whereby said termination material permits surface mount connection of the resistor.
21. A resistor as in claim 20 , wherein said termination material comprises a flexible termination material.
22. A resistor as in claim 21 , wherein said termination material comprises a conductive polymer.
23. A resistor as in claim 20 , wherein said termination material is plated with nickel and tin.
24. A method for providing frequency compensation for resistive components, comprising:
applying an insulating layer over at least a portion of a resistive structure;
applying at least one frequency compensating conductive layer over a portion of the insulating layer; and
adjusting the thickness and material type of the insulating layer and the size of the frequency compensating conductive layer to adjust the frequency compensating capacitance produced between the resistive layer and the at least one frequency compensating conductive layer.
25. An ultra wideband frequency compensated thin film technology resistor, comprising:
an elongated supporting substrate having upper and lower surfaces;
a resistive layer formed on said upper surface of said elongated supporting substrate;
a frequency compensating conductive layer formed over at least a portion of said resistive layer; and
an insulative layer positioned between said resistive layer and said frequency compensating conductive layer.
26. A resistor as in claim 25 , further comprising a pair of contact pads formed at opposite ends of said elongated supporting substrate.
27. A resistor as in claim 25 , wherein said insulative layer comprises an adhesive.
28. A resistor as in claim 27 , further comprising a protective cover secured by said adhesive over said resistive layer and said supporting substrate.
29. An ultra wideband frequency compensated thin film technology resistor, comprising:
an elongated supporting substrate having upper and lower surfaces;
a resistive layer formed on said upper surface of said elongated supporting substrate;
a frequency compensating conductive layer formed over at least a portion of said resistive layer;
an insulative layer positioned between said resistive layer and said frequency compensating conductive layer; and
a pair of contact pads formed at opposite ends of said elongated supporting substrate; wherein
said insulative layer is configured for encasing said resistive layer and said pair of contact pads, thereby forming a sandwich structure with said supporting substrate, said resistive layer, and said contact pads;
said resistor further includes termination material applied at opposite ends of said sandwich structure such that said termination material contacts said contact pads; and
wherein said frequency compensating conductive layer comprises a plurality of conductive layers, at least one of which is directly electrically connected to said termination material,
whereby said termination material permits surface mount connection of the resistor.
30. A resistor as in claim 26 , wherein said contact pads comprise one of copper pads and pads comprising wire bondable material.