Solar cell and method for manufacturing the same
A method of manufacturing a solar cell according to an embodiment includes the steps of: forming an emitter layer by ion-implanting a first conductive type dopant to a first surface of a semiconductor substrate; and forming a back surface field layer by ion-implanting a second conductive type dopant to a second surface of the semiconductor substrate. When an additional dopant is a dopant other than the first and second conductive type dopants, an amount of the additional dopant doped during the forming the back surface field layer is larger than an amount of the additional dopant doped during the forming the emitter layer.
1. A method of manufacturing a solar cell, comprising:
forming an emitter layer by ion-implanting a first dopant having a first conductive type to a first surface of a semiconductor substrate; and
forming a back surface field layer by ion-implanting a second dopant having a second conductive type opposite to the first conductive type to a second surface of the semiconductor substrate,
the emitter layer including hydrogen, wherein an amount of hydrogen doped during the forming the back surface field layer is larger than an amount of hydrogen doped during the forming the emitter layer, and
heat-treating for an activation for the emitter layer and the back surface field layer simultaneously, after the forming the emitter layer and the forming the back surface field layer,
wherein the first dopant is ion-implanted by an ion-selection using a mass spectrometer in the forming the emitter layer, and
wherein the second dopant is ion-implanted without the ion-selection using the mass spectrometer in the forming the back surface field layer,
wherein concentration of additional dopant of the emitter layer is larger than concentration of additional dopant of the back surface field layer,
wherein the additional dopant include hydrogen and at least one additional material selected from the group consisting of potassium (K), calcium (Ca), chrome (Cr), manganese (Mn), iron (Fe), nickel (Ni), and copper (Cu).
2. The method according to claim 1 , wherein a dose of the hydrogen is in a range of about 1×10 14 ˜5×10 15 atoms/cm 2 in the forming the back surface field layer.
3. The method according to claim 1 , wherein a hydrogen concentration in the back surface field layer after the heat-treating is higher than a hydrogen concentration in the emitter layer after the heat-treating.
4. The method according to claim 3 , wherein the hydrogen concentration in the back surface field layer after the heat-treating is lower than the hydrogen concentration in the back surface field layer before the heat-treating.
5. The method according to claim 4 , wherein a portion of the back surface field layer at a distance from the second surface of the semiconductor substrate by about 0.1˜0.4 μm includes an region having the hydrogen concentration in a range of about 1×1018˜1×1020 atoms/cm3 after the heat-treating.
6. The method according to claim 1 , wherein the concentration of the second dopant in the back surface field layer is higher than the concentration of the first dopant in the emitter layer.
7. A method of manufacturing a solar cell, comprising:
forming an emitter layer by ion-implanting a first dopant having a first conductive type to a first surface of a semiconductor substrate;
forming a back surface field layer by ion-implanting a second dopant having a second conductive type opposite to the first conductive type to a second surface of the semiconductor substrate,
wherein the first dopant is ion-implanted by an ion-selection using a mass spectrometer in the forming the emitter layer, and
wherein the second dopant is ion-implanted without the ion-selection using the mass spectrometer in the forming the back surface field layer, and
the emitter layer including hydrogen, wherein an amount of hydrogen doped during the forming the back surface field layer is larger than an amount of hydrogen doped during the forming the emitter layer, and
heat-treating for an activation for the emitter layer and the back surface field layer simultaneously, after the forming the emitter layer and the forming the back surface field layer,
wherein concentration of additional dopant of the emitter layer larger than concentration of additional dopant of the back surface field layer,
wherein the additional dopant include hydrogen and at least one additional material selected from the group consisting of potassium (K), calcium (Ca), chrome (Cr), manganese (Mn). Iron (Fe), nickel (Ni), and copper (Cu).
8. The method according to claim 7 , wherein a dose of the hydrogen is in a range of about 1×10 14 ˜5×10 15 atoms/cm 2 in the forming the back surface field layer.
9. The method according to claim 7 , further comprising:
wherein a hydrogen concentration in the back surface field layer after the heat-treating is higher than a hydrogen concentration in the emitter layer after the heat-treating.
10. The method according to claim 9 , wherein a portion of the back surface field layer at a distance from the second surface of the semiconductor substrate by about 0.1˜0.4 μm includes an region having the hydrogen concentration in a range of about 1×1018˜1×1020 atoms/cm3 after the heat-treating.