IP Library Granted Patent US 9,168,703
Granted Patent B2
US 9,168,703 · App. 13/648,670 · Granted Oct 27, 2015

Curable compositions, processes for using such compositions to prepare composites and processes for preparing composites having superior surface finish and high fiber consolidation

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Quick Facts
Patent No.
US 9,168,703
App. No.
13/648,670
Granted
Oct 27, 2015
Kind
B2
Abstract

Curable compositions, such as oxazine-based ones, are useful in applications within the aerospace industry, such as for example as a thermosetting resin composition for use as a matrix resin in processes, such as resin transfer molding, vacuum assisted transfer molding, resin film infusion, prepregging and towpregging, where the composites or laminates so prepared have superior surface finish and high fiber consolidation.

Claims (16)

1. A process for improving the surface finish of, and the resin consolidation in, a composite or laminate part, steps of which comprise:

providing a preform into a mold;

providing a film comprising: i. a release liner; ii. a first resin; and iii. an expandable agent onto the preform disposed within the mold prior to providing a second resin into the mold;

providing a second resin comprising one or more of oxazine, oxazoline, epoxy, episulfide, cyanate ester, maleimide, nadimide, itaconimide, phenolic, thiophenolic, or combinations thereof, and expandable thermoplastic resin microspheres, into the mold;

subjecting the preform, film and second resin to conditions appropriate to cure the second resin and expand the film to form a composite or laminate part; and

removing the expanded film from the composite or laminate part to reveal a composite or laminate part having improving surface finish and resin consolidation.

2. The process of claim 1 , wherein the release liner is a polytetrafluoroethylene substrate.

3. The process of claim 1 , wherein the first resin comprises an epoxy resin.

4. The process of claim 1 , wherein the epoxy resin comprises bisphenol-A epoxy resin.

5. The process of claim 1 , wherein the expandable agent comprises a blowing agent.

6. The process of claim 1 , wherein the expandable agent comprises expandable thermoplastic resin microspheres.

7. The process of claim 1 , wherein the film further comprises a curing agent.

8. The process of claim 7 , wherein the curing agent is dicyandiamide.

9. The process of claim 1 , wherein the film further comprises a toughener.

10. The process of claim 9 , wherein the toughener is 4,4-diaminodiphenyl sulfone.

11. The process of claim 1 , wherein the second resin comprises an oxazine and an epoxy.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0151 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034183/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2014
From: WONG, ALEX CHOR-YIU; DU, XINYU; LI, WEI HELEN; WONG, RAYMOND S.; FUENTES, NOEL
To: HENKEL CORPORATIOIN
Reel/Frame 032254/0284 →