IP Library Granted Patent US 9,036,350
Granted Patent B2
US 9,036,350 · App. 13/648,769 · Granted May 19, 2015

Barrier device

Inventors: Roger Neil Jackson (Launceston, GB); Rhys Marc Owen (Llanwnog, GB); Gareth Huw Jones (Newtown, GB)
Assignee: CONTROL TECHNIQUES LTD
H05K5/0217G06F17/5068H05K7/20009H05K7/20H05K7/20436H05K7/20145H05K7/20154H05K7/20918H05K5/0213H05K7/00
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Quick Facts
Patent No.
US 9,036,350
App. No.
13/648,769
Granted
May 19, 2015
Kind
B2
Abstract

This disclosure relates to an apparatus and method 10 for protecting an electronic circuit from an airflow. The apparatus 10 comprises a base 12, wherein said base 12 comprises a cover means for covering at least part of the electronic circuit. The apparatus further comprises a guide means for guiding an airflow around the electronic circuit.

Claims (27)

1. An apparatus for protecting one or more electrical components of an electronic circuit from an airflow, said apparatus comprising a base, wherein said base comprises a cover for covering at least part of the one or more electrical components, and wherein said base includes at least one opening arranged to allow a cooling device to protrude at least partially therethrough, said apparatus further comprising a guide for guiding an airflow to the cooling device.

2. An apparatus as claimed in claim 1 wherein said guide comprises at least one wall projecting from said base.

3. An apparatus as claimed in claim 2 wherein said wall includes a locating means for locating a first electronic circuit component relative to a second electronic circuit component.

4. An apparatus as claimed in claim 3 wherein at least one of the first electronic circuit component and the second electronic circuit component is connected to a respective heat sink, and wherein said locating means is arranged to separate said heat sink from another heat sink or from the other respective electronic circuit component.

5. An apparatus as claimed in claim 1 further comprising a housing projecting from said base for surrounding at least part of: an electronic component and/or a heat sink.

6. An apparatus as claimed in claim 5 wherein said housing includes an opening to allow at least part of the electronic component or heat sink to protrude therethrough.

7. An apparatus as claimed in claim 1 wherein said guide comprises a baffle, a barrier, a channel, a duct or a fin for blocking or deflecting an airflow.

8. An apparatus as claimed in claim 1 wherein the at least one opening is arranged to allow an electronic component of the one or more electrical components to protrude at least partially therethrough.

9. An apparatus as claimed in claim 8 comprising first and second openings for locating first and second respective electronic components relative to one another.

10. An apparatus as claimed in claim 8 wherein said opening is arranged to allow an electronic component of the one or more electrical components or the cooling device to protrude therethrough for mechanical connection to a printed circuit board (PCB).

11. An apparatus as claimed in claim 9 further comprising a barrier arranged to provide an electrical clearance barrier and/or a thermal barrier between first and second electronic components.

12. An assembly comprising an apparatus as claimed in claim 1 and the one or more electronic components, wherein the cover within the apparatus covers at least part of the one or more electronic components.

13. An assembly comprising an apparatus as claimed in claim 1 and a PCB connected thereto, said PCB having a surface with an electronic component disposed thereon, wherein the cover within the apparatus covers at least part of said electronic component.

14. An assembly as claimed in claim 13 wherein the apparatus includes an opening and wherein a connector projects from the PCB, through said opening, to form a mechanical connection between the apparatus and the PCB.

15. An assembly as claimed in claim 12 wherein at least one of said one or more electronic components is connected to the cooling device.

16. A method of protecting one or more electrical components of an electronic circuit from an airflow, said method comprising:

mechanically covering at least part of the one or more electrical components; and

guiding the airflow to a cooling device;

wherein said covering and guidance steps are both performed by an apparatus which includes a base having at least one opening arranged to allow the cooling device to protrude at least partially therethrough, said base comprising a cover for covering at least a portion of the one or more electrical components and a guide for guiding airflow to the cooling device.

17. A method of protecting an electronic circuit from an airflow as claimed in claim 16 , wherein the apparatus performing said steps is part of an assembly comprising one or more electronic components, wherein the cover of the apparatus covers at least part of said one or more electronic components.

18. An apparatus as claimed in claim 1 wherein the cooling device is a heat sink.

19. An apparatus comprising:

one or more electrical components;

a base including a cover covering at least part of the one or more electrical components, the base defining at least one opening;

a cooling device protruding at least partially through the at least one opening; and

a guide for guiding an airflow to the cooling device.

20. The apparatus as claimed in claim 19 , wherein said guide comprises at least one wall projecting from said base.

Assignments (2)
CHANGE OF NAME Recorded Mar 23, 2017
From: CONTROL TECHNIQUES LIMITED
To: NIDEC CONTROL TECHNIQUES LIMITED
Reel/Frame 042082/0827 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2013
From: JACKSON, ROGER NEIL; OWEN, RHYS MARC; JONES, GARETH HUW
To: CONTROL TECHNIQUES LTD
Reel/Frame 029561/0397 →
Priority Claims (1)
GB 1117481.0 · Oct 10, 2011 · national
Continuity (1)
Related Publication 20130088834A1 · Apr 11, 2013