IP Library Granted Patent US 9,487,847
Granted Patent B2
US 9,487,847 · App. 13/648,913 · Granted Nov 8, 2016

Polycrystalline diamond compacts, related products, and methods of manufacture

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Quick Facts
Patent No.
US 9,487,847
App. No.
13/648,913
Granted
Nov 8, 2016
Kind
B2
Abstract

Embodiments relate to polycrystalline diamond compacts (“PDCs”) and methods of manufacturing such PDCs in which an at least partially leached polycrystalline diamond (“PCD”) table is infiltrated with a low viscosity cobalt-based alloy infiltrant. In an embodiment, a method includes forming a PCD table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature (“HPHT”) process. The method includes at least partially leaching the PCD table to remove at least a portion of the metal-solvent catalyst therefrom to form an at least partially leached PCD table. The method includes subjecting the at least partially leached PCD table and a substrate to a second HPHT process effective to at least partially infiltrate the at least partially leached PCD table with an alloy infiltrant comprising at least one of a cobalt-based or nickel based alloy infiltrant having a composition at or near a eutectic composition of the alloy infiltrant.

Claims (40)

1. A method of fabricating a polycrystalline diamond compact, comprising:

forming a polycrystalline diamond table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature process, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, at least a portion of the plurality of interstitial regions including the metal-solvent catalyst disposed therein;

at least partially leaching the polycrystalline diamond table to remove at least a portion of the metal-solvent catalyst therefrom to form an at least partially leached polycrystalline diamond table; and

subjecting the at least partially leached polycrystalline diamond table and a substrate having a plurality of carbide grains cemented with a cementing constituent to a second high-pressure/high-temperature process under diamond-stable temperature-pressure conditions effective to at least partially infiltrate the at least partially leached polycrystalline diamond table with a portion of the cementing constituent, wherein the cementing constituent includes an alloy infiltrant comprising a cobalt alloy infiltrant, a nickel alloy infiltrant, or combinations thereof having a composition at or near a eutectic composition.

2. The method of claim 1 wherein the alloy infiltrant comprises cobalt, nickel, or combination thereof, and at least one eutectic forming alloying constituent selected from the group consisting of carbon, silicon, boron, phosphorus, tantalum, titanium, niobium, molybdenum, antimony, tin, and carbides thereof.

3. The method of claim 2 wherein the at least one eutectic forming alloying constituent is present in a hypo-eutectic amount or a hyper-eutectic amount.

4. The method of claim 2 wherein the at least one eutectic forming alloying constituent is present in a hypo-eutectic amount.

5. The method of claim 2 wherein the at least one eutectic forming alloying constituent is silicon, the alloy infiltrant is a nickel-silicon alloy, and the silicon is present in an amount of 11.5% or less by weight of the nickel-silicon alloy.

6. The method of claim 5 wherein the at least one eutectic forming alloying constituent is silicon, the alloy infiltrant is a nickel-silicon alloy, and the silicon is present in an amount of about 7% or less by weight of the nickel-silicon alloy.

7. The method of claim 2 wherein the at least one eutectic forming alloying constituent is carbon, the alloy infiltrant is a nickel-carbon alloy, and the carbon is present in an amount of 2.22% or less by weight of the nickel-carbon alloy.

8. The method of claim 2 wherein the at least one eutectic forming alloying constituent is boron, the alloy infiltrant is a nickel-boron alloy, and the boron is present in an amount of 4% or less by weight of the nickel-boron alloy.

9. The method of claim 2 wherein the at least one eutectic forming alloying constituent is phosphorus, the alloy infiltrant is a nickel-phosphorus alloy, and the phosphorus is present in an amount of 11% or less by weight of the nickel-phosphorus alloy.

10. The method of claim 2 wherein the at least one eutectic forming alloying constituent is cerium, the alloy infiltrant is a nickel-cerium alloy, and the cerium is present in an amount of 19% by weight of the nickel-cerium alloy.

11. The method of claim 2 wherein the at least one eutectic forming alloying constituent is boron and silicon, and the alloy infiltrant is a nickel-boron-silicon alloy.

12. The method of claim 11 , wherein the boron is present in an amount of 4% or less by weight of the nickel-boron-silicon alloy and the silicon is present in an amount of 7% or less by weight of the nickel-boron-silicon alloy, the balance of the nickel-boron-silicon alloy comprising nickel.

13. The method of claim 1 wherein the alloy infiltrant comprises cobalt, nickel, or combinations thereof, and at least one eutectic forming alloying constituent selected from the group consisting of silicon, boron, phosphorous, tantalum, and carbides thereof.

14. The method of claim 1 wherein the first high-pressure/high-temperature process is performed at a cell pressure of at least about 7.5 GPa.

15. The method of claim 1 , further comprising leaching the at least partially infiltrated polycrystalline diamond table to form a region extending inwardly from an exterior working surface thereof that is substantially free of the alloy infiltrant.

16. The method of claim 1 wherein the composition of the alloy infiltrant is 0.1 to 2 times the eutectic composition.

17. The method of claim 16 wherein the composition of the alloy infiltrant is 0.4 to 1.5 times the eutectic composition.

18. The method of claim 17 wherein the composition of the alloy infiltrant is 0.9 to 1.1 times the eutectic composition.

19. The method of claim 1 wherein the infiltration of the alloy infiltrant is only partially complete so that the polycrystalline diamond table includes a first region adjacent to the substrate that includes the alloy infiltrant disposed in at least a portion of the interstitial regions thereof, and a second region extending inwardly from an exterior working surface that is substantially free of the alloy infiltrant.

20. The method of claim 1 wherein the alloy infiltrant is provided from the substrate.

21. The method of claim 1 wherein the substrate includes an intermediate substrate and a base substrate and the alloy infiltrant is provided from the intermediate substrate positioned between the base substrate and the at least partially leached polycrystalline diamond table.

22. The method of claim 21 wherein the intermediate substrate is at least partially received in a recess of the base substrate.

23. The method of claim 1 wherein the polycrystalline diamond table exhibits a coercivity of about 115 Oe to about 250 Oe and a specific magnetic saturation greater than 0 G·cm 3 /g to about 15 G·cm 3 /g.

24. A method of fabricating a polycrystalline diamond compact, the method comprising:

forming a polycrystalline diamond table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature process, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, at least a portion of the plurality of interstitial regions including the metal-solvent catalyst disposed therein;

at least partially leaching the polycrystalline diamond table to remove at least a portion of the metal-solvent catalyst therefrom to form an at least partially leached polycrystalline diamond table; and

subjecting the at least partially leached polycrystalline diamond table and a substrate to a second high-pressure/high-temperature process under diamond-stable temperature-pressure conditions effective to at least partially infiltrate the at least partially leached polycrystalline diamond table with a nickel alloy infiltrant having at least one eutectic forming alloying constituent selected from the group consisting of carbon, silicon, boron, phosphorus, tantalum, titanium, niobium, molybdenum, antimony, tin, cerium, and carbides thereof, the nickel alloy infiltrant having a composition at or near a eutectic composition.

25. The method of claim 24 wherein the at least one eutectic alloying constituent is present in the nickel alloy infiltrant in a hypo-eutectic amount.

26. A method of fabricating a polycrystalline diamond compact, the method comprising:

forming a polycrystalline diamond table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature process, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, at least a portion of the plurality of interstitial regions including the metal-solvent catalyst disposed therein;

at least partially leaching the polycrystalline diamond table to remove at least a portion of the metal-solvent catalyst therefrom to form an at least partially leached polycrystalline diamond table; and

subjecting the at least partially leached polycrystalline diamond table and a substrate to a second high-pressure/high-temperature process under diamond-stable temperature-pressure conditions effective to at least partially infiltrate the at least partially leached polycrystalline diamond table with a nickel-boron-silicon alloy infiltrant having a composition at or near a eutectic composition.

27. The method of claim 26 , wherein the boron is present in an amount of 4% or less by weight of the nickel-boron-silicon alloy and the silicon is present in an amount of 7% or less by weight of the nickel-boron-silicon alloy, the balance of the nickel-boron-silicon alloy comprising nickel.

28. A method of fabricating a polycrystalline diamond compact, the method comprising:

forming a polycrystalline diamond table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature process, the polycrystalline diamond table including a plurality of bonded diamond grains defining a plurality of interstitial regions, at least a portion of the plurality of interstitial regions including the metal-solvent catalyst disposed therein;

at least partially leaching the polycrystalline diamond table to remove at least a portion of the metal-solvent catalyst therefrom to form an at least partially leached polycrystalline diamond table; and

subjecting the at least partially leached polycrystalline diamond table and a substrate to a second high-pressure/high-temperature process under diamond-stable temperature-pressure conditions effective to at least partially infiltrate the at least partially leached polycrystalline diamond table with a cobalt alloy infiltrant having at least one eutectic forming alloying constituent selected from the group consisting of carbon, boron, phosphorus, antimony, and tin, wherein the cobalt alloy infiltrant has a composition at or near a eutectic composition.

Assignments (6)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2012
From: MUKHOPADHYAY, DEBKUMAR; GONZALEZ, JAIR J
To: US SYNTHETIC CORPORATION
Reel/Frame 029209/0916 →