IP Library › Granted Patent US 9,604,392
Granted Patent B2
US 9,604,392 · App. 13/649,605 · Granted Mar 28, 2017

Cooling fixtures for molded components

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,604,392
App. No.
13/649,605
Granted
Mar 28, 2017
Kind
B2
Abstract

A cooling fixture for molded components includes a support surface, at least two brackets coupled to the support surface, and at least one roller having a central axis. The roller is coupled between the brackets for rotating about its central axis and is positioned for contacting a portion of a molded component and rotating about its central axis as necessary to align the molded component and substantially inhibit gouging of the molded component when the molded component is placed in the cooling fixture for cooling. Additional cooling fixtures and related methods are also disclosed.

Claims (22)

1. A method of using a cooling fixture having at least one roller for cooling a cavity molded component, the method comprising:

removing a cavity molded component from a cavity mold; and

placing the cavity molded component in the cooling fixture for cooling with the at least one roller contacting a portion of the cavity molded component and rotating as necessary to align said portion of the cavity molded component without substantially gouging the cavity molded component.

2. The method of claim 1 further comprising maintaining a plurality of dimensions of the cavity molded component while the cavity molded component cools.

3. The method of claim 2 wherein maintaining includes using a first end of the roller for maintaining a first span dimension of the cavity molded component and a second end of the roller for maintaining a second span dimension of the cavity molded component.

4. The method of claim 1 further comprising attaching at least one part to the cavity molded component while the cavity molded component cools in the cooling fixture.

5. The method of claim 1 wherein the cavity molded component comprises a polyolefin material.

6. The method of claim 5 wherein the polyolefin material is a high density polyethylene (HDPE) material.

7. A method of using a cooling fixture including two rollers for cooling a molded component, the method comprising:

removing a molded component from a mold, the molded component including a substantially U-shaped portion; and

placing the molded component in the cooling fixture for cooling by positioning opposite ends of the substantially U-shaped portion in contact with the two rollers and rotating the two rollers as necessary to align said U-shaped portion of the molded component without substantially gouging the molded component.

8. A method of using a cooling fixture having at least one roller for cooling a molded support base for a telecommunications equipment pedestal, the method comprising:

removing the molded support base for a telecommunications equipment pedestal from a mold; and

placing the molded support base in the cooling fixture for cooling with the at least one roller contacting a portion of the molded support base and rotating as necessary to align said portion of the molded support base without substantially gouging the molded support base.

9. The method of claim 7 , wherein the molded component is a cavity molded component and removing the molded component includes removing the molded component from a cavity mold.

10. The method of claim 8 , wherein the molded support base is a cavity molded support base and removing the support base includes removing the support base from a cavity mold.

11. The method of claim 7 , wherein the molded component comprises a polyolefin material.

12. The method of claim 11 , wherein the polyolefin material is a high density polyethylene (HDPE) material.

13. The method of claim 8 , wherein the molded support base comprises a polyolefin material.

14. The method of claim 13 , wherein the polyolefin material is a high density polyethylene (HDPE) material.

15. The method of claim 1 , wherein the cavity molded component comprises a support base for a telecommunications equipment pedestal.

16. The method of claim 7 , wherein the molded component comprises a support base for a telecommunications equipment pedestal.

Assignments (10)
SECURITY INTEREST Recorded Oct 26, 2021
From: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.
To: UMB BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 057923/0782 →
SECURITY AGREEMENT Recorded Mar 3, 2020
From: ELECTRICAL RELIABILITY SERVICES, INC.; ENERGY LABS, INC.; VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.
To: CITIBANK, N.A.
Reel/Frame 052076/0874 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: JPMORGAN CHASE BANK, N.A.
To: VERTIV CORPORATION (F/K/A ALBER CORP.); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT CORPORATION); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT FREMONT, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT HUNTSVILLE, LLC); VERTIV IT SYSTEMS, INC. (F/K/A AVOCENT REDMOND CORP.); ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV CORPORATION (F/K/A EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.); VERTIV CORPORATION (F/K/A LIEBERT CORPORATION)
Reel/Frame 052065/0666 →
RELEASE OF SECURITY INTEREST Recorded Mar 2, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY N.A.
To: VERTIV CORPORATION; VERTIV IT SYSTEMS, INC.; ELECTRICAL RELIABILITY SERVICES, INC.
Reel/Frame 052071/0913 →
MERGER Recorded Feb 5, 2020
From: VERTIV ENERGY SYSTEMS, INC.
To: VERTIV CORPORATION
Reel/Frame 051830/0692 →
SECOND LIEN SECURITY AGREEMENT Recorded Jun 10, 2019
From: VERTIV IT SYSTEMS, INC.; VERTIV CORPORATION; VERTIV NORTH AMERICA, INC.; ELECTRICAL RELIABILITY SERVICES, INC.; VERTIV ENERGY SYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049415/0262 →
CHANGE OF NAME Recorded May 16, 2017
From: EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.
To: VERTIV ENERGY SYSTEMS, INC.
Reel/Frame 042469/0671 →
SECURITY AGREEMENT Recorded Dec 2, 2016
From: ALBER CORP.; ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; ELECTRICAL RELIABILITY SERVICES, INC.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.; NORTHERN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040797/0615 →
SECURITY AGREEMENT Recorded Dec 1, 2016
From: ALBER CORP.; ASCO POWER TECHNOLOGIES, L.P.; AVOCENT CORPORATION; AVOCENT FREMONT, LLC; AVOCENT HUNTSVILLE, LLC; AVOCENT REDMOND CORP.; ELECTRICAL RELIABILITY SERVICES, INC.; EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.; LIEBERT CORPORATION; LIEBERT NORTH AMERICA, INC.; NORTHERN TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 040783/0148 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2013
From: CHEN, SIMON SHEN-MENG; MALONEY, JEROME
To: EMERSON NETWORK POWER, ENERGY SYSTEMS, NORTH AMERICA, INC.
Reel/Frame 029613/0680 →